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Journal description
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Details for article 11 of 27 found articles
| Title: |
Enhanced stress relaxation of Sn–3.8Ag–0.7Cu solder by electrical current |
| Author: |
Liu, Haiyan Zhu, Qingsheng Zhang, Li Wang, Zhongguang Shang, Jian Ku |
| Appeared in: |
Journal of materials research |
| Paging: | Volume 25 () nr. 6 pages 1172-1178 |
| Year: |
2010-06-01 |
| Contents: | |
| Publisher: |
Springer International Publishing, Cham |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 11 of 27 found articles
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