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Journal description
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Details for article 3 of 29 found articles
| Title: |
Dissolution of Cu into Sn-based solders during reflow soldering |
| Author: |
Lee, Jong-Hyun Shin, Dong-Hyuk Kim, Yong-Seog |
| Appeared in: |
Metals and materials international |
| Paging: | Volume 9 (2003) nr. 6 pages 577-581 |
| Year: |
2003 |
| Contents: | |
| Publisher: |
The Korean Institute of Metals and Materials, Seoul |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 29 found articles
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