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Journal description
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Details for article 17 of 17 found articles
| Title: |
Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation |
| Author: |
Wunderle, Bernhard Becker, K.-F. Sinning, R. Wittler, O. Schacht, R. Walter, H. Schneider-Ramelow, M. Halser, K. Simper, N. Michel, B. Reichl, H. |
| Appeared in: |
Microsystem technologies |
| Paging: | Volume 15 (2009) nr. 9 pages 1467-1478 |
| Year: |
2009 |
| Contents: | |
| Publisher: |
Springer-Verlag, Berlin/Heidelberg |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 17 of 17 found articles
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