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Journal description
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Details for article 6 of 42 found articles
| Title: |
Characterization of reflow soldering at a peak temperature of 215 °C using a Bi-coated Sn-3.0Ag-0.5Cu solder ball |
| Author: |
Hwang, Jun Ho Lee, Jong-Hyun |
| Appeared in: |
Applied surface science |
| Paging: | Volume 454 (2018) nr. C pages 227-232 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 6 of 42 found articles
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