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Journal description
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Details for article 88 of 187 found articles
| Title: |
High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed |
| Author: |
Druais, G. Dilliway, G. Fischer, P. Guidotti, E. Lühn, O. Radisic, A. Zahraoui, S. |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 85 (2008) nr. 10 pages 5 p. |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 88 of 187 found articles
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