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Journal description
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Details for article 87 of 187 found articles
| Title: |
High aspect ratio copper through-silicon-vias for 3D integration |
| Author: |
Song, Chongshen Wang, Zheyao Chen, Qianwen Cai, Jian Liu, Litian |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 85 (2008) nr. 10 pages 5 p. |
| Year: |
2008 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 87 of 187 found articles
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