|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 152 of 187 found articles
| Title: |
Stress analysis of 3-dimensional IC package as function of structural design parameters |
| Author: |
Ladani, Leila J. |
| Appeared in: |
Microelectronic engineering |
| Paging: | Volume 87 (2010) nr. 10 pages 9 p. |
| Year: |
2010 |
| Contents: | |
| Publisher: |
Elsevier B.V. |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 152 of 187 found articles
| << previous | next >> |