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Journal description
All volumes of the corresponding journal
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Details for article 12 of 27 found articles
| Title: |
High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height |
| Author: |
Amalu, Emeka H. Ekere, N.N. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 52 (2012) nr. 12 pages 13 p. |
| Year: |
2012 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 12 of 27 found articles
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