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Journal description
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Details for article 29 of 29 found articles
| Title: |
Thermal fracture toughness measurement for underfill during temperature change |
| Author: |
Park, Soojae Feger, Claudius |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 3 pages 7 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 29 of 29 found articles
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