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Journal description
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Details for article 28 of 29 found articles
| Title: |
The influence of solder composition on the impact strength of lead-free solder ball grid array joints |
| Author: |
Tsukamoto, H. Nishimura, T. Suenaga, S. McDonald, S.D. Sweatman, K.W. Nogita, K. |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 3 pages 11 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 28 of 29 found articles
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