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Journal description
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Details for article 7 of 28 found articles
| Title: |
Cu wire bond microstructure analysis and failure mechanism |
| Author: |
Yu, Cheng-Fu Chan, Chi-Ming Chan, Li-Chun Hsieh, Ker-Chang |
| Appeared in: |
Microelectronics reliability |
| Paging: | Volume 51 (2011) nr. 1 pages 6 p. |
| Year: |
2011 |
| Contents: | |
| Publisher: |
Elsevier Ltd |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 7 of 28 found articles
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