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                                       Details for article 2 of 28 found articles
 
 
  Anomalous microstructure formed at the interface between copper ribbon and tin-deposited copper plate by ultrasonic bonding
 
 
Title: Anomalous microstructure formed at the interface between copper ribbon and tin-deposited copper plate by ultrasonic bonding
Author: Maeda, Masakatsu
Sato, Takaaki
Inoue, Naoto
Yagi, Daisuke
Takahashi, Yasuo
Appeared in: Microelectronics reliability
Paging: Volume 51 (2011) nr. 1 pages 7 p.
Year: 2011
Contents:
Publisher: Elsevier Ltd
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 2 of 28 found articles
 
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