| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Chapter 1. Assembly and Mounting of Electronic Devices: Advancements in Technology and Equipment
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 269-288
|
artikel
|
| 2 |
Chapter 5. Assembly and Mounting of Electronic Modules on Printed Circuit Boards
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 342-373
|
artikel
|
| 3 |
Chapter 8. Assembly and Mounting of Microwave Micromodules and Microblocks
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 454-462
|
artikel
|
| 4 |
Chapter 10. High-Frequency Soldering Technology in Electronics
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 492-507
|
artikel
|
| 5 |
Chapter 14. Interblock Mounting of Electronic Equipment
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 567-571
|
artikel
|
| 6 |
Chapter 11. Laser Soldering of Electronic Modules
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 508-519
|
artikel
|
| 7 |
Chapter 2. Materials for Building Electrical Connections
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 289-316
|
artikel
|
| 8 |
Chapter 12: Microassembly of Integrated Circuits and Micromodules
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 520-552
|
artikel
|
| 9 |
Chapter 4. Physicochemical Foundations of Electric Mounting Soldering
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 332-341
|
artikel
|
| 10 |
Chapter 15: Quality Control of Assembly and Mounting
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 572-598
|
artikel
|
| 11 |
Chapter 13. Sealing of Integrated Circuits and Microblocks
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 553-566
|
artikel
|
| 12 |
Chapter 3. Solderability of Materials and Electronic Components
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 317-331
|
artikel
|
| 13 |
Chapter 6. Surface Mount Assembly of Electronic Modules
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 374-407
|
artikel
|
| 14 |
Chapter 7. Technology for the Assembly and Mounting of Micromodules
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 408-453
|
artikel
|
| 15 |
Chapter 9. Ultrasonic Soldering and Metallization in Electronics
|
Lanin, V. L.
|
|
|
60 |
3 |
p. 463-491
|
artikel
|
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