| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Aging and fracture of human cortical bone and tooth dentin
|
Koester, Kurt J.
|
|
2008
|
60 |
6 |
p. 33-38
|
artikel
|
| 2 |
Aging and loading rate effects on the mechanical behavior of equine bone
|
Kulin, Robb M.
|
|
2008
|
60 |
6 |
p. 39-44
|
artikel
|
| 3 |
A novel low-temperature solder based on intermetallic-compound phases: Alloy design, high-homologous temperature properties, and reliability
|
Suh, Daewoong
|
|
2008
|
60 |
6 |
p. 71-76
|
artikel
|
| 4 |
An overview of Pb-free, flip-chip wafer-bumping technologies
|
Kang, Sung K.
|
|
2008
|
60 |
6 |
p. 66-70
|
artikel
|
| 5 |
Biological materials science and engineering: Biological materials, biomaterials, and biomimetics
|
Meyers, M. A.
|
|
2008
|
60 |
6 |
p. 21-22
|
artikel
|
| 6 |
Broadening of MSE: The role of (and challenges to) professional societies
|
Apelian, Diran
|
|
2008
|
60 |
6 |
p. 18-19
|
artikel
|
| 7 |
Choosing a career path with the sloan career cornerstone center
|
Zappas, Kelly Roncone
|
|
2008
|
60 |
6 |
p. 96
|
artikel
|
| 8 |
In the final analysis
|
|
|
2008
|
60 |
6 |
p. 2
|
artikel
|
| 9 |
Lead-free and lead-bearing electronic solders: Implementation, reliability, and new technology
|
Kao, C. Robert
|
|
2008
|
60 |
6 |
p. 60
|
artikel
|
| 10 |
Porous ceramic scaffolds with complex architectures
|
Munch, E.
|
|
2008
|
60 |
6 |
p. 54-58
|
artikel
|
| 11 |
Steel and science bring dinosaurs into the 21st century at the carnegie museum of natural history
|
Byko, Maureen
|
|
2008
|
60 |
6 |
p. 12-16
|
artikel
|
| 12 |
Structural biological materials: Overview of current research
|
Chen, P. -Y.
|
|
2008
|
60 |
6 |
p. 23-32
|
artikel
|
| 13 |
The development of biocomposite nanofibers for tissue scaffolding applications
|
Zhang, Y. Z.
|
|
2008
|
60 |
6 |
p. 45-48
|
artikel
|
| 14 |
The effect of pre-aging on the electromigration of flip-chip SnAg solder joints
|
Yang, Po-Chun
|
|
2008
|
60 |
6 |
p. 77-80
|
artikel
|
| 15 |
The effect of pre-aging on the electromigration of flip-chip SnAg solder joints
|
Yang, Po-Chun
|
|
|
60 |
6 |
p. 77-80
|
artikel
|
| 16 |
The nanoindentation of soft tissue: Current and developing approaches
|
Franke, Oliver
|
|
2008
|
60 |
6 |
p. 49-53
|
artikel
|
| 17 |
The root causes of the “Black pad” phenomenon and avoidance tactics
|
Suganuma, Katsuaki
|
|
2008
|
60 |
6 |
p. 61-65
|
artikel
|
| 18 |
The thin-film deposition of conjugated molecules for organic electronics
|
Jin, Michael H. -C.
|
|
2008
|
60 |
6 |
p. 81-86
|
artikel
|
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