| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
An investigation of phase transformation behavior in sputter-deposited PtMn thin films
|
Ji, C. -X.
|
|
|
58 |
6 |
p. 50-54
|
artikel
|
| 2 |
An investigation of phase transformation behavior in sputter-deposited PtMn thin films
|
Ji, C. -X.
|
|
2006
|
58 |
6 |
p. 50-54
|
artikel
|
| 3 |
A synchrotron radiation x-ray microdiffraction study on orientation relationships between a Cu6 Sn5 and Cu substrate in solder joints
|
Suh, J. O.
|
|
2006
|
58 |
6 |
p. 63-66
|
artikel
|
| 4 |
Flash-assist RTP for ultra-shallow junctions
|
Camm, D. M.
|
|
2006
|
58 |
6 |
p. 32-34
|
artikel
|
| 5 |
Flow visualization for semi-solid processing
|
Atkinson, Helen V.
|
|
2006
|
58 |
6 |
p. 21-23
|
artikel
|
| 6 |
High-density plasma-arc heating studies of FePt thin films
|
Cole, Amanda
|
|
|
58 |
6 |
p. 39-42
|
artikel
|
| 7 |
High-density plasma-arc heating studies of FePt thin films
|
Cole, Amanda
|
|
2006
|
58 |
6 |
p. 39-42
|
artikel
|
| 8 |
In the final analysis
|
Robinson, James J.
|
|
2006
|
58 |
6 |
p. 2
|
artikel
|
| 9 |
Items of note from the field, profession, and society
|
|
|
2006
|
58 |
6 |
p. 6-11
|
artikel
|
| 10 |
Lead-free implementation: Reliability, alloy development, and new technology
|
Chada, Srinivas
|
|
2006
|
58 |
6 |
p. 56
|
artikel
|
| 11 |
Letters to the Editor
|
|
|
2006
|
58 |
6 |
p. 4-5
|
artikel
|
| 12 |
Novel rare-earth-containing lead-free solders with enhanced ductility
|
Dudek, M. A.
|
|
|
58 |
6 |
p. 57-62
|
artikel
|
| 13 |
Novel rare-earth-containing lead-free solders with enhanced ductility
|
Dudek, M. A.
|
|
2006
|
58 |
6 |
p. 57-62
|
artikel
|
| 14 |
Numerical simulation of high-density plasma-arc processing of FePt nanoparticle films
|
Sabau, Adrian S.
|
|
2006
|
58 |
6 |
p. 35-38
|
artikel
|
| 15 |
Presenting upcoming TMS meetings and calls for papers
|
|
|
2006
|
58 |
6 |
p. 80-87
|
artikel
|
| 16 |
Pulsed-thermal processing of chemically synthesized FePt nanoparticles
|
Shi, Shifan
|
|
2006
|
58 |
6 |
p. 43-45
|
artikel
|
| 17 |
Pulse-thermal processing for electronic applications
|
Ott, Ronald
|
|
2006
|
58 |
6 |
p. 31
|
artikel
|
| 18 |
Reflections on a life of materials science: Robert Cahn and The Art of Belonging
|
Roncone, Kelly
|
|
2006
|
58 |
6 |
p. 88
|
artikel
|
| 19 |
Solidification defects revisited and semi-solid processing
|
Lewis, Daniel
|
|
2006
|
58 |
6 |
p. 12
|
artikel
|
| 20 |
The basics of modern semi-solid metal processing
|
Czerwinski, Frank
|
|
2006
|
58 |
6 |
p. 17-20
|
artikel
|
| 21 |
The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging
|
Deppisch, Carl
|
|
2006
|
58 |
6 |
p. 67-74
|
artikel
|
| 22 |
The microstructural characterization of semi-solid slurries
|
Nafisi, Shahrooz
|
|
2006
|
58 |
6 |
p. 24-30
|
artikel
|
| 23 |
The pulse-thermal processing of NdFeB-based nanocomposite magnets
|
Jin, Z. Q.
|
|
2006
|
58 |
6 |
p. 46-49
|
artikel
|
| 24 |
The root cause of black pad failure of solder joints with electroless Ni/Immersion gold plating
|
Zeng, Kejun
|
|
2006
|
58 |
6 |
p. 75-79
|
artikel
|
| 25 |
Titanium investiment casting defects: A metallographic overview
|
Cotton, J. D.
|
|
2006
|
58 |
6 |
p. 13-16
|
artikel
|
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