| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
|
Kang, Sung K.
|
|
|
55 |
6 |
p. 61-65
|
article
|
| 2 |
Ag3Sn plate formation in the solidification of near-ternary eutectic Sn-Ag-Cu
|
Kang, Sung K.
|
|
2003
|
55 |
6 |
p. 61-65
|
article
|
| 3 |
Complying with the statutory written description requirement in a U.S. utility patent application
|
Silverman, Arnold B.
|
|
2003
|
55 |
6 |
p. 80
|
article
|
| 4 |
In the final analysis
|
|
|
2003
|
55 |
6 |
p. 4
|
article
|
| 5 |
Lead-free solders and processing issues in microelectronics
|
Fournelle, Raymond A.
|
|
|
55 |
6 |
p. 49
|
article
|
| 6 |
Lead-free solders and processing issues in microelectronics
|
Fournelle, Raymond A.
|
|
2003
|
55 |
6 |
p. 49
|
article
|
| 7 |
Materials resource center: Consultants directory
|
|
|
2003
|
55 |
6 |
p. 77
|
article
|
| 8 |
Materials resource center: Positions available
|
|
|
2003
|
55 |
6 |
p. 78-79
|
article
|
| 9 |
Measuring the mechanical properties of Pb-free solder and Sn-based intermetallics by nanoindentation
|
Chromik, R. R.
|
|
|
55 |
6 |
p. 66-69
|
article
|
| 10 |
Measuring the mechanical properties of Pb-free solder and Sn-based intermetallics by nanoindentation
|
Chromik, R. R.
|
|
2003
|
55 |
6 |
p. 66-69
|
article
|
| 11 |
Meetings calendar
|
|
|
2003
|
55 |
6 |
p. 71-76
|
article
|
| 12 |
News & update
|
|
|
2003
|
55 |
6 |
p. 5-12
|
article
|
| 13 |
Prototype analysis of gravity-modulated welding by inverting weld cross sections
|
Cooper, K. P.
|
|
2003
|
55 |
6 |
p. 21-26
|
article
|
| 14 |
Solidification and liquation cracking issues in welding
|
Kou, Sindo
|
|
|
55 |
6 |
p. 37-42
|
article
|
| 15 |
Solidification and liquation cracking issues in welding
|
Kou, Sindo
|
|
2003
|
55 |
6 |
p. 37-42
|
article
|
| 16 |
Solidification issues in welding research and practice
|
Cooper, K. P.
|
|
2003
|
55 |
6 |
p. 13
|
article
|
| 17 |
Submicron particle chemistry: Vapor condensation analogous to liquid solidification
|
Jenkins, Neil T.
|
|
|
55 |
6 |
p. 44-47
|
article
|
| 18 |
Submicron particle chemistry: Vapor condensation analogous to liquid solidification
|
Jenkins, Neil T.
|
|
2003
|
55 |
6 |
p. 44-47
|
article
|
| 19 |
The compression stress-strain behavior of Sn-Ag-Cu solder
|
Vianco, Paul T.
|
|
2003
|
55 |
6 |
p. 50-55
|
article
|
| 20 |
The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder
|
Ochoa, F.
|
|
|
55 |
6 |
p. 56-60
|
article
|
| 21 |
The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder
|
Ochoa, F.
|
|
2003
|
55 |
6 |
p. 56-60
|
article
|
| 22 |
Upcoming editorial topics
|
|
|
2003
|
55 |
6 |
p. 48
|
article
|
| 23 |
Weld analysis using an inverse-problem approach based on quasi-one-dimensional interpolation
|
Lambrakos, S. G.
|
|
|
55 |
6 |
p. 27-36
|
article
|
| 24 |
Weld analysis using an inverse-problem approach based on quasi-one-dimensional interpolation
|
Lambrakos, S. G.
|
|
2003
|
55 |
6 |
p. 27-36
|
article
|
| 25 |
Welding: Solidification and microstructure
|
David, S. A.
|
|
|
55 |
6 |
p. 14-20
|
article
|
| 26 |
Welding: Solidification and microstructure
|
David, S. A.
|
|
2003
|
55 |
6 |
p. 14-20
|
article
|
Journal description