| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A linear microactuator with enhanced design
|
Edler, J.
|
|
2002
|
7 |
5-6 |
p. 261-264
|
artikel
|
| 2 |
A new approach for the assembly of lenses in front of flexible miniature fibre-scopes
|
Pfeifer, T.
|
|
2002
|
7 |
5-6 |
p. 220-224
|
artikel
|
| 3 |
Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering
|
Elger, G.
|
|
2002
|
7 |
5-6 |
p. 239-243
|
artikel
|
| 4 |
High quality laser beam soldering
|
Bosse, L.
|
|
2002
|
7 |
5-6 |
p. 215-219
|
artikel
|
| 5 |
Laser micromaching and light induced reaction injection molding as suitable process sequence for the rapid fabrication of microcomponents
|
Hanemann, T.
|
|
2002
|
7 |
5-6 |
p. 209-214
|
artikel
|
| 6 |
Microfabrication of single-use plastic microfluidic devices for high-throughput screening and DNA analysis
|
Gerlach, A.
|
|
2002
|
7 |
5-6 |
p. 265-268
|
artikel
|
| 7 |
Microsensor packaging
|
Brand, O.
|
|
2002
|
7 |
5-6 |
p. 205-208
|
artikel
|
| 8 |
MICRO SYSTEM Technologies 2001, Conference, Düsseldorf, 27th to 29th March 2001
|
,
|
|
2002
|
7 |
5-6 |
p. 203
|
artikel
|
| 9 |
Motion from the nanoscale world
|
Klocke, V.
|
|
2002
|
7 |
5-6 |
p. 256-260
|
artikel
|
| 10 |
Multichip module with free-space optical interconnects and VCSEL-solder-joints
|
Gimkiewicz, C.
|
|
2002
|
7 |
5-6 |
p. 249-255
|
artikel
|
| 11 |
Pb-free Sn/3.5Ag wafer-bumping process and UBM (under bump metallurgy) study
|
Jang, S.-Y.
|
|
2002
|
7 |
5-6 |
p. 269-272
|
artikel
|
| 12 |
Reduction of the optical loss and optimization of polycyanurate thermosets used in integrated optics
|
Dreyer, C.
|
|
2002
|
7 |
5-6 |
p. 229-238
|
artikel
|
| 13 |
Safety relevant microsystems for automotive applications
|
Seidel, H.
|
|
2002
|
7 |
5-6 |
p. 244-248
|
artikel
|
| 14 |
Wear resistant tools for reproduction technologies produced by micro powder metallurgy
|
Rota, A.
|
|
2002
|
7 |
5-6 |
p. 225-228
|
artikel
|
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