nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Active positioning device for a perimodiolar cochlear electrode array
|
Arcand, B. Y. |
|
2004 |
|
6-7 |
p. 478-483 |
artikel |
2 |
A fast settling servo controller for high-density disk drives
|
Kang, C.-I. |
|
2003 |
|
6-7 |
p. 484-495 |
artikel |
3 |
A Micro corona motor fabricated by a SU-8 built-on X-ray mask
|
Lee, S. |
|
2004 |
|
6-7 |
p. 522-526 |
artikel |
4 |
Analysis and design of hydrodynamic journal air bearings for high performance HDD spindle
|
Hwang, T. |
|
2003 |
|
6-7 |
p. 386-394 |
artikel |
5 |
A surface micromachining process for suspended RF-MEMS applications using porous silicon
|
Ding, Y. |
|
2003 |
|
6-7 |
p. 470-473 |
artikel |
6 |
Combination of thick resist and electroforming technologies for monolithic inkjet application
|
Chung, C. K. |
|
2004 |
|
6-7 |
p. 462-466 |
artikel |
7 |
Continuation and change
|
Michel, Bernd |
|
2003 |
|
6-7 |
p. 379-380 |
artikel |
8 |
Deep sub micron high aspect ratio polymer structures produced by hard X-ray lithography
|
Achenbach, S. |
|
2004 |
|
6-7 |
p. 493-497 |
artikel |
9 |
Design and development of a piezoresistive pressure sensor on micromachined silicon for high-temperature applications and of a signal-conditioning electronic circuit
|
Crescini, D. |
|
2003 |
|
6-7 |
p. 431-435 |
artikel |
10 |
Design of flexural pivot for use in hard disc drive actuator
|
He, Z. |
|
2003 |
|
6-7 |
p. 453-460 |
artikel |
11 |
Determination of mechanical properties of slip cast, micro powder injection moulded and microcast high aspect ratio microspecimens
|
Auhorn, M. |
|
2004 |
|
6-7 |
p. 489-492 |
artikel |
12 |
Development of a freestanding copper antiscatter grid using deep X-ray lithography
|
Makarova, O. V. |
|
2003 |
|
6-7 |
p. 395-398 |
artikel |
13 |
Dynamic finite element analysis of a micro lobe pump
|
Huber, N. |
|
2003 |
|
6-7 |
p. 465-469 |
artikel |
14 |
Effect of workpiece springback on micromilling forces
|
Friedrich, C. R. |
|
2004 |
|
6-7 |
p. 472-477 |
artikel |
15 |
Effects of microstructure on the mechanical properties of copper films for high aspect ratio structures
|
Cordill, M. J. |
|
2004 |
|
6-7 |
p. 451-455 |
artikel |
16 |
Electrodeposited nickel–manganese: an alloy for microsystem applications
|
Goods, S. H. |
|
2004 |
|
6-7 |
p. 498-505 |
artikel |
17 |
Electromechanical model of RF MEMS switches
|
Zhang, L. X. |
|
2003 |
|
6-7 |
p. 420-426 |
artikel |
18 |
Evaluation of optical qualities of a LIGA-spectrometer in SU-8
|
Mappes, T. |
|
2004 |
|
6-7 |
p. 560-563 |
artikel |
19 |
Fabrication of focused two-dimensional grids
|
Makarova, O. V. |
|
2004 |
|
6-7 |
p. 540-543 |
artikel |
20 |
Fabrication of grids and collimators using SU-8 as a mold
|
Makarova, O. V. |
|
2004 |
|
6-7 |
p. 536-539 |
artikel |
21 |
Fabrication of microchannels in negative resist
|
Liu, G. |
|
2003 |
|
6-7 |
p. 461-464 |
artikel |
22 |
Fast prototyping of high-aspect ratio, high-resolution X-ray masks by gas-assisted focused ion beam
|
Malek, C. Khan |
|
2003 |
|
6-7 |
p. 409-412 |
artikel |
23 |
High-aspect-ratio microstructure filling by centrifugal force field modeling
|
Tsai, T.-H. |
|
2004 |
|
6-7 |
p. 571-577 |
artikel |
24 |
High aspect ratio spiral and vertical meander micro coils for actuator applications
|
Seidemann, V. |
|
2004 |
|
6-7 |
p. 564-570 |
artikel |
25 |
High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging
|
Lin, C.-J. |
|
2004 |
|
6-7 |
p. 517-521 |
artikel |
26 |
High speed sub-micron bit detection using tapered aperture mounted optical slider flying above a patterned metal medium
|
Ohkubo, T. |
|
2003 |
|
6-7 |
p. 413-419 |
artikel |
27 |
Injection molding of 316L stainless steel microstructures
|
Liu, Z. Y. |
|
2003 |
|
6-7 |
p. 507-510 |
artikel |
28 |
Local heat transfer characteristics in a single rotating disk and co-rotating disks
|
Cho, H. H. |
|
2003 |
|
6-7 |
p. 399-408 |
artikel |
29 |
Metrology of high aspect ratio MEMS
|
Nichols, J. F. |
|
2004 |
|
6-7 |
p. 556-559 |
artikel |
30 |
Micro assembly injection moulding for the generation of hybrid microstructures
|
Michaeli, W. |
|
2003 |
|
6-7 |
p. 427-430 |
artikel |
31 |
Microfabrication and test of a magnetic field sensor using electrodeposited thin film of giant magnetoresistive (Cu/Co)x multilayers
|
Zhang, H. |
|
2003 |
|
6-7 |
p. 436-440 |
artikel |
32 |
Micro gas bearings fabricated by deep X-ray lithography
|
Kim, D. |
|
2004 |
|
6-7 |
p. 456-461 |
artikel |
33 |
Micro-hinges changed flexural rigidity intermittently for micromechanism joints
|
Horie, M. |
|
2003 |
|
6-7 |
p. 381-385 |
artikel |
34 |
Micromachining of highly reproducible step substrates for high Tc step junction dc-SQUIDs
|
Wang, J. |
|
2003 |
|
6-7 |
p. 480-483 |
artikel |
35 |
Modal analysis of a unimorph piezoelectrical transducer
|
Liu, C. |
|
2003 |
|
6-7 |
p. 474-479 |
artikel |
36 |
Modeling of angular-rate bandwidth for a vibrating microgyroscope
|
Hong, Y. |
|
2003 |
|
6-7 |
p. 441-448 |
artikel |
37 |
Preface: Harmst2003
|
Hruby, Jill |
|
2004 |
|
6-7 |
p. 439 |
artikel |
38 |
Production of identical pyramid wavefront sensors for multi-conjugate adaptive optic systems using the LIGA process
|
Pérennès, F. |
|
2004 |
|
6-7 |
p. 552-555 |
artikel |
39 |
Replication of LIGA structures using microcasting
|
Baumeister, G. |
|
2004 |
|
6-7 |
p. 484-488 |
artikel |
40 |
Replication of micro components by different variants of injection molding
|
Piotter, V. |
|
2004 |
|
6-7 |
p. 547-551 |
artikel |
41 |
Replication of microlens arrays by injection molding
|
Lee, B.-K. |
|
2004 |
|
6-7 |
p. 531-535 |
artikel |
42 |
Selection of mold materials for electroforming of monolithic two-layer microstructure
|
Chung, C. K. |
|
2004 |
|
6-7 |
p. 467-471 |
artikel |
43 |
Shape deviations in masks for optical structures produced by electron beam lithography
|
Last, A. |
|
2004 |
|
6-7 |
p. 527-530 |
artikel |
44 |
SOI wafer mold with high-aspect-ratio microstructures for hot embossing process
|
Zhao, Y. |
|
2004 |
|
6-7 |
p. 544-546 |
artikel |
45 |
The mechanical properties, dimensional tolerance and microstructural characterization of micro-molded ceramic and metal components
|
Garino, T. J. |
|
2004 |
|
6-7 |
p. 506-509 |
artikel |
46 |
The role of microstructure in the electrical and thermal conductivity of Ni-alloys for LIGA microsystems
|
Graham, S. |
|
2004 |
|
6-7 |
p. 510-516 |
artikel |
47 |
Three-dimensional micro-structures consisting of high aspect ratio inclined micro-pillars fabricated by simple photolithography
|
Sato, H. |
|
2004 |
|
6-7 |
p. 440-443 |
artikel |
48 |
Two-dimensional modeling of nickel electrodeposition in LIGA microfabrication
|
Chen, K. S. |
|
2004 |
|
6-7 |
p. 444-450 |
artikel |
49 |
Ultra thin chips for miniaturized products
|
Jung, E. |
|
2003 |
|
6-7 |
p. 449-452 |
artikel |
50 |
Ultraviolet embossing for patterning high aspect ratio polymeric microstructures
|
Chan-Park, M. B. |
|
2003 |
|
6-7 |
p. 501-506 |
artikel |
51 |
Vibro-acoustic interaction of components in hard disk drive under seek process
|
Gao, F. |
|
2003 |
|
6-7 |
p. 496-500 |
artikel |