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                             20 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Adhesion of polymer thin-films and patterned lines Christopher S. Litteken
2003
119 4 p. 475-485
11 p.
artikel
2 Channel cracking during thermal cycling of thin film multi-layers M.R. Begley
2003
119 4 p. 325-338
14 p.
artikel
3 Channel cracking in thin films on substrates of finite thickness J.J. Vlassak
2003
119 4 p. 299-323
25 p.
artikel
4 Characterization of interconnect interfacial adhesion by cross-sectional nanoindentation T. Scherban
2003
119 4 p. 421-429
9 p.
artikel
5 Co-planar crack interaction in cleaved mica J.C. Hill
2003
119 4 p. 365-386
22 p.
artikel
6 CTOD for the through-the-thickness crack in a plate of arbitrary thickness Andrei Kotousov
2003
119 4 p. L99-L104
6 p.
artikel
7 Effects of diffusion on interfacial fracture of gold-chromium hybrid microcircuit films N.R. Moody
2003
119 4 p. 407-419
13 p.
artikel
8 Eshelby's formula for an ellipsoidal elastic inclusion in anisotropic poroelasticity and thermoelasticity Valery M. Levin
2003
119 4 p. L77-L82
6 p.
artikel
9 Fiducial mark and CTOA estimates of thin film adhesion Alex A. Volinsky
2003
119 4 p. 431-439
9 p.
artikel
10 Flow and fracture of free-standing Ag and Cu thin films and Ag/Cu multilayers Haibo Huang
2003
119 4 p. 359-364
6 p.
artikel
11 High-cycle fatigue of micron-scale polycrystalline silicon films: fracture mechanics analyses of the role of the silica/silicon interface C.L. Muhlstein
2003
119 4 p. 449-474
26 p.
artikel
12 Indentation induced film fracture in hard film soft substrate systems D.F. Bahr
2003
119 4 p. 339-349
11 p.
artikel
13 In situ TEM observations of fracture in nanolaminated metallic thin films T. Foecke
2003
119 4 p. 351-357
7 p.
artikel
14 Length scales for the fracture of nanostructures William W. Gerberich
2003
119 4 p. 387-405
19 p.
artikel
15 Measurement of the noibium/sapphire interface toughness via delamination H. Je
2003
119 4 p. 441-448
8 p.
artikel
16 Mechanical properties and fracture toughness of organo-silicate glass (OSG) low-k dielectric thin films for microelectronic applications J.B. Vella
2003
119 4 p. 487-499
13 p.
artikel
17 Micromechanics modeling of plastic yielding in a solid containing mode III cohesive cracks Shaofan Li
2003
119 4 p. L105-L112
8 p.
artikel
18 Path-independent integrals and crack extension force for functionally graded materials Shi Weichen
2003
119 4 p. L83-L89
7 p.
artikel
19 Stress concentration around a strongly oblate spheroidal cavity in a transversely isotropic medium Chiang, Chun-Ron
2003
119 4 p. L91-L97
artikel
20 Stress concentration around a strongly oblate spheroidal cavity in a transversely isotropic medium Chun-Ron Chiang
2003
119 4 p. L91-L97
7 p.
artikel
                             20 gevonden resultaten
 
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