nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A Comprehensive Study of Intermetallic Compounds in Solar Cell Interconnections and their Growth Kinetics
|
Geipel, Torsten |
|
2016 |
98 |
C |
p. 86-97 12 p. |
artikel |
2 |
Editorial to the Proceedings of the 6th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells
|
Schubert, Gunnar |
|
2016 |
98 |
C |
p. 1- 1 p. |
artikel |
3 |
Effects of Aluminum in Metallization Paste on the Electrical Losses in Bifacial N-type Crystalline Silicon Solar Cells
|
Aoyama, Takayuki |
|
2016 |
98 |
C |
p. 106-114 9 p. |
artikel |
4 |
Flexo-printed Busbarless Solar Cells for Multi-wire Interconnection
|
Lorenz, A. |
|
2016 |
98 |
C |
p. 46-60 15 p. |
artikel |
5 |
Front Metal Finger Inhomogeneity: Its Influence on Optimization and on the Cell Efficiency Distribution in Production Lines
|
Chen, Y. |
|
2016 |
98 |
C |
p. 30-39 10 p. |
artikel |
6 |
High Speed Dispensing with Novel 6” Print Head
|
Pospischil, M. |
|
2016 |
98 |
C |
p. 61-65 5 p. |
artikel |
7 |
Low Cost Semi Automated Assembly Unit for Small Size Back Contact Modules and Low Cost Interconnection Approach
|
Meßmer, Tobias |
|
2016 |
98 |
C |
p. 98-105 8 p. |
artikel |
8 |
Low-temperature Interconnection of PVD-Aluminium Metallization
|
Geipel, Torsten |
|
2016 |
98 |
C |
p. 125-135 11 p. |
artikel |
9 |
Materials Challenge for Shingled Cells Interconnection
|
Beaucarne, Guy |
|
2016 |
98 |
C |
p. 115-124 10 p. |
artikel |
10 |
Post-plating Annealing of Light Induced Plated Copper Fingers: Implications for Reliable Metallization
|
Song, Ning |
|
2016 |
98 |
C |
p. 136-141 6 p. |
artikel |
11 |
Silver Grid Finger Corrosion on Snail Track affected PV Modules – Investigation on Degradation Products and Mechanisms
|
Duerr, Ines |
|
2016 |
98 |
C |
p. 74-85 12 p. |
artikel |
12 |
Single Print Metal Stencils for High-efficiency PERC Solar Cells
|
Hannebauer, H. |
|
2016 |
98 |
C |
p. 40-45 6 p. |
artikel |
13 |
Summary of the 6th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells
|
Beaucarne, Guy |
|
2016 |
98 |
C |
p. 2-11 10 p. |
artikel |
14 |
The Future of Metallization and Interconnection – Forecast of Experts of the 6th Metallization Workshop
|
Schubert, Gunnar |
|
2016 |
98 |
C |
p. 12-22 11 p. |
artikel |
15 |
Transition to 4 and 5 BB Designs for Ni/Cu/Ag Plated Cells
|
Burschik, J. |
|
2016 |
98 |
C |
p. 66-73 8 p. |
artikel |
16 |
Understanding Metal Induced Recombination Losses in Silicon Solar Cells with Screen Printed Silver Contacts
|
Inns, Daniel |
|
2016 |
98 |
C |
p. 23-29 7 p. |
artikel |