nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A Multiscale Fabrication Approach to Microfluidic System Development
|
Schmitz, T.L. |
|
2004 |
6 |
1 |
p. 88-96 9 p. |
artikel |
2 |
A Nickel Aluminide Microchannel Array Heat Exchanger for High-Temperature Applications
|
Kanlayasiri, K. |
|
2004 |
6 |
1 |
p. 72-80 9 p. |
artikel |
3 |
Design, Simulation, and Microfabrication of a Heat-Conduction DNA Chip with Integrated Microheaters
|
Li, Shifeng |
|
2004 |
6 |
1 |
p. 81-87 7 p. |
artikel |
4 |
LIGA Microsystems: Surface Interactions, Tribology, and Coatings
|
Prasad, Somuri V. |
|
2004 |
6 |
1 |
p. 107-116 10 p. |
artikel |
5 |
Localized Laser Transmission Bonding for Microsystem Fabrication and Packaging
|
Theppakuttai, S. |
|
2004 |
6 |
1 |
p. 24-31 8 p. |
artikel |
6 |
Machining, Assembly, and Characterization of a Mesoscale Double Shell Target
|
Bono, Matthew J. |
|
2004 |
6 |
1 |
p. 97-106 10 p. |
artikel |
7 |
Machining Channels on Mesoscale Ceramic Components
|
Shin, H.-W. |
|
2004 |
6 |
1 |
p. 15-23 9 p. |
artikel |
8 |
Measuring the Metrology Gap – Three-Dimensional Metrology at the Mesoscopic Level
|
Peggs, G.N. |
|
2004 |
6 |
1 |
p. 117-124 8 p. |
artikel |
9 |
Micro and Mesoscale Robotic Assembly
|
Popa, Dan O. |
|
2004 |
6 |
1 |
p. 52-71 20 p. |
artikel |
10 |
Process Characterization and Material Flow in Microforming at Elevated Temperatures
|
Egerer, Emil |
|
2004 |
6 |
1 |
p. 1-6 6 p. |
artikel |
11 |
Study of Pulse Electrochemical Micromachining
|
Kozak, J. |
|
2004 |
6 |
1 |
p. 7-14 8 p. |
artikel |
12 |
Uncertainty in Manufacture and Assembly of Multiple-Joint Solder Self-Assembled Microelectromechanical Systems (MEMS)
|
Kladitis, Paul E. |
|
2004 |
6 |
1 |
p. 32-50 19 p. |
artikel |