| no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
| 1 |
A comparison of material removal mechanism under low stress abrasive condition of steel and hardfacing alloys
|
Dasgupta, R.
|
|
1999
|
8 |
4 |
p. 437-442
|
article
|
| 2 |
An acoustic emission study of cutting bauxite refractory ceramics by abrasive water jets
|
Momber, A. W.
|
|
1999
|
8 |
4 |
p. 450-454
|
article
|
| 3 |
Corrosion-fatigue behavior of an annealed AISI 1045 carbon steel coated with electroless nickel-phosphorus
|
Pertuz, A.
|
|
1999
|
8 |
4 |
p. 424-428
|
article
|
| 4 |
Effect of cooling rate on eutectic cell count, grain size, microstructure, and ultimate tensile strength of hypoeutectic cast iron
|
Hemanth, J.
|
|
1999
|
8 |
4 |
p. 417-423
|
article
|
| 5 |
Effect of deformation temperature on the mechanical behavior and deformation mechanisms of Al-Al2O3 metal matrix composites
|
Mazen, A. A.
|
|
1999
|
8 |
4 |
p. 487-495
|
article
|
| 6 |
Effects of induction hardening and prior cold work on a microalloyed medium carbon steel
|
Cunningham, J. L.
|
|
1999
|
8 |
4 |
p. 401-408
|
article
|
| 7 |
How good are linear viscoelastic properties of asphalt binder to predict rutting and fatigue cracking?
|
Chen, J. -S.
|
|
1999
|
8 |
4 |
p. 443-449
|
article
|
| 8 |
Machinability of hypereutectic silicon-aluminum alloys
|
Tanaka, T.
|
|
1999
|
8 |
4 |
p. 463-468
|
article
|
| 9 |
Microstructure and grain growth behavior of an aluminum alloy metal matrix composite processed by disintegrated melt deposition
|
Gupta, M.
|
|
1999
|
8 |
4 |
p. 473-478
|
article
|
| 10 |
Performance of vegetable oils as a cooling medium in comparison to a standard mineral oil
|
Totten, G. E.
|
|
1999
|
8 |
4 |
p. 409-416
|
article
|
| 11 |
Processing and microstructure of alumina-based composites
|
Mujahid, M.
|
|
1999
|
8 |
4 |
p. 496-500
|
article
|
| 12 |
Pulsed electrode surfacing of steel with TiC coating: Microstructure and wear properties
|
Agarwal, A.
|
|
1999
|
8 |
4 |
p. 479-486
|
article
|
| 13 |
Tape casting of high dielectric ceramic substrates for microelectronics packaging
|
Tok, A. I. Y.
|
|
1999
|
8 |
4 |
p. 469-472
|
article
|
| 14 |
Ultrasonic measurements of stiffness in thermal-mechanically fatigued IM7/5260 composites
|
Seale, M. D.
|
|
1999
|
8 |
4 |
p. 429-436
|
article
|
| 15 |
Weldability evaluation of high tensile plates using GMAW process
|
Datta, R.
|
|
1999
|
8 |
4 |
p. 455-462
|
article
|
Journal description