nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
AC Hopping Conductance in Nanocomposite Films with Ferromagnetic Alloy Nanoparticles in a PbZrTiO3 Matrix
|
Koltunowicz, T.N. |
|
2015 |
44 |
7 |
p. 2260-2268 |
artikel |
2 |
Al-Ge Diffusion Bonding for Hermetic Sealing Application
|
Chidambaram, Vivek |
|
2015 |
44 |
7 |
p. 2387-2395 |
artikel |
3 |
Aspects of Integrating Functional Electroceramic Material in Multilayer Thin Films for Image Sensing: Modeling and Experiment
|
Matin, M.A. |
|
2015 |
44 |
7 |
p. 2544-2553 |
artikel |
4 |
CH4/Ar/H2/SF6 Plasma Etching for Surface Oxide Removal of Indium Bumps
|
Huang, Yue |
|
2015 |
44 |
7 |
p. 2467-2472 |
artikel |
5 |
Creep Behavior of 95.8Sn–3.5Ag–0.7Cu Solder Joints, and a Modified Constitutive Model for the Joints
|
Tang, Y. |
|
2015 |
44 |
7 |
p. 2440-2449 |
artikel |
6 |
Determination of Initial Crack Strength of Silicon DieUsing Acoustic Emission Technique
|
Chen, Pei-Chi |
|
2015 |
44 |
7 |
p. 2497-2506 |
artikel |
7 |
Dielectric and Electrical Properties of BiFeO3–LiTaO3 Systems
|
Mohanty, Suchismita |
|
2015 |
44 |
7 |
p. 2359-2368 |
artikel |
8 |
Dielectric Behavior and Magnetic Properties of Mn-Substituted Ni–Zn Ferrites
|
Irfan, Muhammad |
|
2015 |
44 |
7 |
p. 2369-2377 |
artikel |
9 |
Effect of Lubricants and Annealing Treatment on the Electrical Conductivity and Microstructure of Rolled Copper Foil
|
Xiong, Sang |
|
2015 |
44 |
7 |
p. 2432-2439 |
artikel |
10 |
Effect of Thermal Aging on the Mechanical Properties of Sn3.0Ag0.5Cu/Cu Solder Joints Under High Strain Rate Conditions
|
Nguyen, Van Luong |
|
2015 |
44 |
7 |
p. 2414-2421 |
artikel |
11 |
Effects of Bi2O3, TiO2, and Bi4Ti3O12 Seeding Layers on the Structural and Electrical Properties of Bi3.25La0.75Ti3O12 Thin Films Grown by a Sol–Gel Method
|
Pei, Ling |
|
2015 |
44 |
7 |
p. 2340-2347 |
artikel |
12 |
Effects of Gd-Substitutions on the Microstructure, Electrical and Electromagnetic Behavior of M-Type Hexagonal Ferrites
|
Ahmad, Ishtiaq |
|
2015 |
44 |
7 |
p. 2221-2229 |
artikel |
13 |
Enhanced Dielectric Properties and High-Temperature Microwave Absorption Performance of Zn-Doped Al2O3 Ceramic
|
Wang, Yuan |
|
2015 |
44 |
7 |
p. 2353-2358 |
artikel |
14 |
Enhancing Chemical Stability of Electroplated Cu Filmsby Engineering Electrolyte Chemistry and Twinning Structure
|
Yang, Chih-Jie |
|
2015 |
44 |
7 |
p. 2529-2535 |
artikel |
15 |
Erratum to: Aspects of Integrating Functional Electroceramic Material in Multilayer Thin Films for Image Sensing: Modeling and Experiment
|
Matin, M.A. |
|
2015 |
44 |
7 |
p. 2554 |
artikel |
16 |
Ferroelectric and Magnetodielectric Properties of Cobalt-Doped SrxBa1−xNb2O6 Ceramics
|
Kshirsagar, S. H. |
|
2015 |
44 |
7 |
p. 2321-2330 |
artikel |
17 |
Fumed-Alumina-Derived Nanoporous Alumina as a New Low-k Dielectric Material for Microelectronics Packaging
|
Takizawa, Yoshihiro |
|
2015 |
44 |
7 |
p. 2211-2220 |
artikel |
18 |
High Dielectric Constants of Composites of Fiber-Like Copper Phthalocyanine-Coated Graphene Oxide Embedded in Poly(arylene Ether Nitriles)
|
Li, Jingwei |
|
2015 |
44 |
7 |
p. 2378-2386 |
artikel |
19 |
Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention
|
Chen, Wenjun |
|
2015 |
44 |
7 |
p. 2479-2487 |
artikel |
20 |
Hysteresis Phenomenon in Heat–Voltage Curves of Polypyrrole-Coated Electrospun Nanofibrous and Regular Fibrous Mats
|
Oroumei, Azam |
|
2015 |
44 |
7 |
p. 2250-2259 |
artikel |
21 |
Increase of Piezoelectric Constant and Thermal Durability of Polypropylene Electret by Introducing SiO2 and Kaolin Filler and Creating a Cellular Structure
|
Klimiec, E. |
|
2015 |
44 |
7 |
p. 2283-2291 |
artikel |
22 |
Influence of BaTiO3 Nanoparticle Addition on Microstructure and Mechanical Properties of Sn-58Bi Solder
|
Yang, Li |
|
2015 |
44 |
7 |
p. 2473-2478 |
artikel |
23 |
Investigation of the Absorption Properties of the Alloys Fe-Ni and Fe-Ni-Cr Prepared by Mechanical Alloying
|
Shuchao, Gu |
|
2015 |
44 |
7 |
p. 2331-2339 |
artikel |
24 |
Low-Temperature Sintering and Microwave Dielectric Properties of Zn2SiO4 Ceramic Added with CrystallineZinc Borate
|
Chaware, Varsha |
|
2015 |
44 |
7 |
p. 2312-2320 |
artikel |
25 |
Measurement of Dielectric Properties of Ultrafine BaTiO3Using an Organic–Inorganic Composite Method
|
Bao, Jie |
|
2015 |
44 |
7 |
p. 2300-2307 |
artikel |
26 |
Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate
|
Liu, Yang |
|
2015 |
44 |
7 |
p. 2450-2457 |
artikel |
27 |
Microwave-Assisted Synthesis of High Dielectric Constant CaCu3Ti4O12 from Sol–Gel Precursor
|
Ouyang, Xin |
|
2015 |
44 |
7 |
p. 2243-2249 |
artikel |
28 |
On the Manipulation of Ferroelectric and Ferroelastic Domains at the Nanoscale
|
Durkan, Colm |
|
2015 |
44 |
7 |
p. 2230-2242 |
artikel |
29 |
Orientation-Dependent Properties of CoFe2O4-Bi3.15Nd0.85Ti3O12 Bilayer Multiferroic Films Prepared by a Sol–Gel Method
|
Zhang, Fuwei |
|
2015 |
44 |
7 |
p. 2348-2352 |
artikel |
30 |
Phase Equilibria of the Sn–Ni–Si Ternary System and Interfacial Reactions in Sn–(Cu)/Ni–Si Couples
|
Fang, Gu |
|
2015 |
44 |
7 |
p. 2422-2431 |
artikel |
31 |
Polystyrene-Core Silica-Shell Composite Abrasives: The Influence of Core Size on Oxide Chemical Mechanical Planarization
|
Chen, Ailian |
|
2015 |
44 |
7 |
p. 2522-2528 |
artikel |
32 |
Preventing Electrical Shorts in Parallel-Plate Capacitorswith Single-Printed Dielectric Layer
|
Horvat, Maša |
|
2015 |
44 |
7 |
p. 2488-2496 |
artikel |
33 |
Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate
|
Ko, Yong-Ho |
|
2015 |
44 |
7 |
p. 2458-2466 |
artikel |
34 |
Size-Controllable Synthesis of Fe3O4 Nanospheres for Electromagnetic Wave Absorber
|
Wang, Yanping |
|
2015 |
44 |
7 |
p. 2292-2299 |
artikel |
35 |
Stretchability of Silver Films on Thin Acid-Etched Rough Polydimethylsiloxane Substrates Fabricatedby Electrospray Deposition
|
Mehdi, S.M. |
|
2015 |
44 |
7 |
p. 2514-2521 |
artikel |
36 |
Study of Optical and Electrical Properties of In2S3:Sn Films Deposited by Spray Pyrolysis
|
Kraini, M. |
|
2015 |
44 |
7 |
p. 2536-2543 |
artikel |
37 |
Study of Thermally Enhanced 2.5D Packages with Multi-chips Molded on Silicon Interposer
|
Zhang, H. Y. |
|
2015 |
44 |
7 |
p. 2396-2405 |
artikel |
38 |
Superior Dielectric Performance of Engineering Thermoplastic as a Result of In situ Embedding of Nanoscale Mixed-Phase Molybdenum Oxide
|
Qureshi, Nilam |
|
2015 |
44 |
7 |
p. 2269-2275 |
artikel |
39 |
Synthesis and Properties of Single Domain StrontiumHexa-ferrite Ultrafine Powders via a Surfactant-AssistedCo-precipitation Method
|
Liu, Junliang |
|
2015 |
44 |
7 |
p. 2276-2282 |
artikel |
40 |
Synthesis and UV-Curing Behaviors of Urethane Acrylic Oligomers Modified by the Incorporation of Silicone Diols into the Soft Segments for a 3D Multi-Chip Package Process
|
Lee, Seung-Woo |
|
2015 |
44 |
7 |
p. 2406-2413 |
artikel |
41 |
The Influence of Pd-Doped Au Wire Bonding on HAZ Microstructure and Looping Profile in Micro-Electromechanical Systems (MEMS) Packaging
|
Ismail, Roslina |
|
2015 |
44 |
7 |
p. 2507-2513 |
artikel |
42 |
Tuning Magnetic Behavior of Nanoscale Cobalt Sulfide and Its Nanocomposite with an Engineering Thermoplastic
|
Rumale, Narendra |
|
2015 |
44 |
7 |
p. 2308-2311 |
artikel |