| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Architectured Materials to Improve the Reliability of Power Electronics Modules: Substrate and Lead-Free Solder
|
Kaabi, Abderrahmen
|
|
2013
|
43 |
3 |
p. 648-657
|
artikel
|
| 2 |
3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters
|
Belhenini, Soufyane
|
|
2014
|
43 |
3 |
p. 708-716
|
artikel
|
| 3 |
Dynamic Mechanical Properties and Thermal Effect of an Epoxy Resin Composite, Encapsulation’s Element of a New Electronic Component
|
Rmili, W.
|
|
2013
|
43 |
3 |
p. 702-707
|
artikel
|
| 4 |
Effects of Annealing Temperature on the Electric Propertiesof 0.94(Na0.5Bi0.5)TiO3–0.06BaTiO3 Ferroelectric Thin Film
|
Peng, J. F.
|
|
2013
|
43 |
3 |
p. 724-731
|
artikel
|
| 5 |
Effects of Thickness and Annealing on Optoelectronic Properties of Electrodeposited ZnS Thin Films for Photonic Device Applications
|
Echendu, O. K.
|
|
2013
|
43 |
3 |
p. 791-801
|
artikel
|
| 6 |
High Performance Bottom-Gate-Type Amorphous InGaZnO Flexible Transparent Thin-Film Transistors Deposited on PET Substrates at Low Temperature
|
Lee, Hsin-Ying
|
|
2014
|
43 |
3 |
p. 780-785
|
artikel
|
| 7 |
Indentation Creep of Lead-Free Sn-5Sb Solder Alloy with 1.5 wt% Ag and Bi Additions
|
Geranmayeh, A.R.
|
|
2013
|
43 |
3 |
p. 717-723
|
artikel
|
| 8 |
Investigation of Structural and Electrical Properties of B-Site Complex Ion (Mg1/3Nb2/3)4+-Modified High-Curie-Temperature BiFeO3-BaTiO3 Ceramics
|
Zhou, Xiujuan
|
|
2014
|
43 |
3 |
p. 755-760
|
artikel
|
| 9 |
Local and Global Properties of a Lead-Free Solder
|
Ma, Z.
|
|
2013
|
43 |
3 |
p. 658-670
|
artikel
|
| 10 |
Mechanical and Electrical Reliability Assessment of Stacking of Ultrathin Chips on Si Interposer Using Back-to-Face Architecture
|
Parès, G.
|
|
2013
|
43 |
3 |
p. 685-694
|
artikel
|
| 11 |
p-on-n HgCdTe Infrared Focal-Plane Arrays: From Short-Wave to Very-Long-Wave Infrared
|
Mollard, L.
|
|
2013
|
43 |
3 |
p. 802-807
|
artikel
|
| 12 |
Pressure-Free Bonding of Metallic Plates with Ni Affinity Layers Using Cu Nanoparticles
|
Ishizaki, Toshitaka
|
|
2014
|
43 |
3 |
p. 774-779
|
artikel
|
| 13 |
Reduction of Dislocation Density in HVPE-Grown GaN Epilayers by Using In Situ-Etched Porous Templates
|
Zhao, Z. D.
|
|
2013
|
43 |
3 |
p. 786-790
|
artikel
|
| 14 |
SiC Die Attach for High-Temperature Applications
|
Drevin-Bazin, A.
|
|
2013
|
43 |
3 |
p. 695-701
|
artikel
|
| 15 |
Strong Enhancement of Near-Band-Edge Photoluminescence of ZnO Nanowires Decorated with Sputtered Metallic Nanoparticles
|
Purahmad, Mohsen
|
|
2013
|
43 |
3 |
p. 740-745
|
artikel
|
| 16 |
Structural, Dielectric, and Electrical Properties of BiFeWO6 Ceramic
|
Rout, Jyoshna
|
|
2013
|
43 |
3 |
p. 732-739
|
artikel
|
| 17 |
Structure–Diffusion Relationship of Magnetron-SputteredWTi Barriers Used in Indium Interconnections
|
Le Priol, A.
|
|
2013
|
43 |
3 |
p. 641-647
|
artikel
|
| 18 |
Substitutional Atom Influence on the Electronic and Transport Properties of Mn4Si7
|
Allam, Ali
|
|
2013
|
43 |
3 |
p. 761-773
|
artikel
|
| 19 |
Thermal Conductivity Measurement of Low-k Dielectric Films: Effect of Porosity and Density
|
Alam, M. T.
|
|
2013
|
43 |
3 |
p. 746-754
|
artikel
|
| 20 |
Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies
|
Kpobie, W.
|
|
2013
|
43 |
3 |
p. 671-684
|
artikel
|
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