| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Amorphization and Solid-Phase Epitaxial Growth of C-Cluster Ion-Implanted Si
|
Rudawski, N.G.
|
|
2009
|
38 |
9 |
p. 1926-1930
|
artikel
|
| 2 |
A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints
|
Lambrinou, Konstantina
|
|
2009
|
38 |
9 |
p. 1881-1895
|
artikel
|
| 3 |
Characterization of Zn1−xMgxO Films Prepared by the Sol–Gel Process and Their Application for Thin-Film Transistors
|
Tsay, Chien-Yie
|
|
2009
|
38 |
9 |
p. 1962-1968
|
artikel
|
| 4 |
Comparative Study on MOCVD Growth of a-Plane GaN Films on r-Plane Sapphire Substrates Using GaN, AlGaN, and AlN Buffer Layers
|
Dai, J. N.
|
|
2009
|
38 |
9 |
p. 1938-1943
|
artikel
|
| 5 |
Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles
|
Shi, Yaowu
|
|
2009
|
38 |
9 |
p. 1866-1873
|
artikel
|
| 6 |
Constitutive Relations of Indium in Extreme-Temperature Electronic Packaging Based on Anand Model
|
Chang, Rui Wu
|
|
2009
|
38 |
9 |
p. 1855-1859
|
artikel
|
| 7 |
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model
|
Vianco, P. T.
|
|
2009
|
38 |
9 |
p. 1815-1825
|
artikel
|
| 8 |
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model
|
Vianco, P. T.
|
|
|
38 |
9 |
p. 1815-1825
|
artikel
|
| 9 |
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study
|
Vianco, P. T.
|
|
2009
|
38 |
9 |
p. 1826-1837
|
artikel
|
| 10 |
Edge-Emitting Lead Salt Mid-Infrared Laser Structure on BaF2 (110) Substrate
|
Li, D.
|
|
2009
|
38 |
9 |
p. 1952-1955
|
artikel
|
| 11 |
Electrical Characterization of Different Passivation Treatments for Long-Wave Infrared InAs/GaSb Strained Layer Superlattice Photodiodes
|
Banerjee, Koushik
|
|
2009
|
38 |
9 |
p. 1944-1947
|
artikel
|
| 12 |
Electrical Properties of Isotropic Conductive Adhesives Composed of Silicone-Based Elastomer Binders Containing Ag Particles
|
Inoue, Masahiro
|
|
2009
|
38 |
9 |
p. 2013-2022
|
artikel
|
| 13 |
Electrical Properties of Organic–Inorganic Semiconductor Device Based on Rhodamine-101
|
Çakar, M.
|
|
2009
|
38 |
9 |
p. 1995-1999
|
artikel
|
| 14 |
Femtosecond Laser Drilling of Alumina Wafers
|
Li, Chengde
|
|
2009
|
38 |
9 |
p. 2006-2012
|
artikel
|
| 15 |
Fracture Mechanics of Solder Bumps During Ball Shear Testing: Effect of Bump Size
|
Bang, Woong Ho
|
|
2009
|
38 |
9 |
p. 1896-1905
|
artikel
|
| 16 |
How r-Plane Al2O3 Surface Modifications Impact the Growth of Epitaxial (001) CeO2 Thin Films
|
Sunder, Madhana
|
|
2009
|
38 |
9 |
p. 1931-1937
|
artikel
|
| 17 |
Interband Cascade Lasers with Wavelengths Spanning 3.2–4.2 μm
|
Canedy, C. L.
|
|
2009
|
38 |
9 |
p. 1948-1951
|
artikel
|
| 18 |
Intermetallic Reaction of Indium and Silver in an Electroplating Process
|
Wang, Pin J.
|
|
2009
|
38 |
9 |
p. 1860-1865
|
artikel
|
| 19 |
Low Fatigue in Epitaxial Pb(Zr0.2Ti0.8)O3 on Si Substrates with LaNiO3 Electrodes by RF Sputtering
|
Wang, Chun
|
|
2009
|
38 |
9 |
p. 1921-1925
|
artikel
|
| 20 |
Monitoring the Growth of the α Phase in Tin Alloys by Electrical Resistance Measurements
|
Di Maio, D.
|
|
2009
|
38 |
9 |
p. 1874-1880
|
artikel
|
| 21 |
Preparation and Characterization of Ultrasonically Sprayed Zinc Oxide Thin Films Doped with Lithium
|
Bilgin, Vildan
|
|
2009
|
38 |
9 |
p. 1969-1978
|
artikel
|
| 22 |
p-Type PbTe Thermoelectric Bulk Materials with Nanograins Fabricated by Attrition Milling and Spark Plasma Sintering
|
Kuo, Chia-Hung
|
|
2009
|
38 |
9 |
p. 1956-1961
|
artikel
|
| 23 |
Rutherford Backscattering Spectrometry Analysis of Self-Formed Ti-Rich Interface Layer Growth in Cu(Ti)/Low-k Samples
|
Kohama, Kazuyuki
|
|
2009
|
38 |
9 |
p. 1913-1920
|
artikel
|
| 24 |
Silicon Nitride Films Deposited by RF Sputtering for Microstructure Fabrication in MEMS
|
Bhatt, Vivekanand
|
|
2009
|
38 |
9 |
p. 1979-1989
|
artikel
|
| 25 |
Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 1: Eutectic Lead Solder
|
Zhao, H.
|
|
2009
|
38 |
9 |
p. 1838-1845
|
artikel
|
| 26 |
Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 2: Lead-Free Solders
|
Zhao, H.
|
|
2009
|
38 |
9 |
p. 1846-1854
|
artikel
|
| 27 |
Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints
|
Dong, Wenxing
|
|
2009
|
38 |
9 |
p. 1906-1912
|
artikel
|
| 28 |
Synthesis and Characterization of Naphthalene End-Capped Divinylbenzene for OTFT
|
Park, Sung Jin
|
|
2009
|
38 |
9 |
p. 2000-2005
|
artikel
|
| 29 |
Two Layer Surface Exfoliation on Si3N4/Si by Sequential Implantation of He and H Ions
|
Li, Mengkai
|
|
2009
|
38 |
9 |
p. 1990-1994
|
artikel
|
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