nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Amorphization and Solid-Phase Epitaxial Growth of C-Cluster Ion-Implanted Si
|
Rudawski, N.G. |
|
2009 |
38 |
9 |
p. 1926-1930 |
artikel |
2 |
A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints
|
Lambrinou, Konstantina |
|
2009 |
38 |
9 |
p. 1881-1895 |
artikel |
3 |
Characterization of Zn1−xMgxO Films Prepared by the Sol–Gel Process and Their Application for Thin-Film Transistors
|
Tsay, Chien-Yie |
|
2009 |
38 |
9 |
p. 1962-1968 |
artikel |
4 |
Comparative Study on MOCVD Growth of a-Plane GaN Films on r-Plane Sapphire Substrates Using GaN, AlGaN, and AlN Buffer Layers
|
Dai, J. N. |
|
2009 |
38 |
9 |
p. 1938-1943 |
artikel |
5 |
Constitutive Relations for Creep in a SnCu-Based Composite Solder Reinforced with Ag Particles
|
Shi, Yaowu |
|
2009 |
38 |
9 |
p. 1866-1873 |
artikel |
6 |
Constitutive Relations of Indium in Extreme-Temperature Electronic Packaging Based on Anand Model
|
Chang, Rui Wu |
|
2009 |
38 |
9 |
p. 1855-1859 |
artikel |
7 |
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model
|
Vianco, P. T. |
|
2009 |
38 |
9 |
p. 1815-1825 |
artikel |
8 |
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model
|
Vianco, P. T. |
|
|
38 |
9 |
p. 1815-1825 |
artikel |
9 |
Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study
|
Vianco, P. T. |
|
2009 |
38 |
9 |
p. 1826-1837 |
artikel |
10 |
Edge-Emitting Lead Salt Mid-Infrared Laser Structure on BaF2 (110) Substrate
|
Li, D. |
|
2009 |
38 |
9 |
p. 1952-1955 |
artikel |
11 |
Electrical Characterization of Different Passivation Treatments for Long-Wave Infrared InAs/GaSb Strained Layer Superlattice Photodiodes
|
Banerjee, Koushik |
|
2009 |
38 |
9 |
p. 1944-1947 |
artikel |
12 |
Electrical Properties of Isotropic Conductive Adhesives Composed of Silicone-Based Elastomer Binders Containing Ag Particles
|
Inoue, Masahiro |
|
2009 |
38 |
9 |
p. 2013-2022 |
artikel |
13 |
Electrical Properties of Organic–Inorganic Semiconductor Device Based on Rhodamine-101
|
Çakar, M. |
|
2009 |
38 |
9 |
p. 1995-1999 |
artikel |
14 |
Femtosecond Laser Drilling of Alumina Wafers
|
Li, Chengde |
|
2009 |
38 |
9 |
p. 2006-2012 |
artikel |
15 |
Fracture Mechanics of Solder Bumps During Ball Shear Testing: Effect of Bump Size
|
Bang, Woong Ho |
|
2009 |
38 |
9 |
p. 1896-1905 |
artikel |
16 |
How r-Plane Al2O3 Surface Modifications Impact the Growth of Epitaxial (001) CeO2 Thin Films
|
Sunder, Madhana |
|
2009 |
38 |
9 |
p. 1931-1937 |
artikel |
17 |
Interband Cascade Lasers with Wavelengths Spanning 3.2–4.2 μm
|
Canedy, C. L. |
|
2009 |
38 |
9 |
p. 1948-1951 |
artikel |
18 |
Intermetallic Reaction of Indium and Silver in an Electroplating Process
|
Wang, Pin J. |
|
2009 |
38 |
9 |
p. 1860-1865 |
artikel |
19 |
Low Fatigue in Epitaxial Pb(Zr0.2Ti0.8)O3 on Si Substrates with LaNiO3 Electrodes by RF Sputtering
|
Wang, Chun |
|
2009 |
38 |
9 |
p. 1921-1925 |
artikel |
20 |
Monitoring the Growth of the α Phase in Tin Alloys by Electrical Resistance Measurements
|
Di Maio, D. |
|
2009 |
38 |
9 |
p. 1874-1880 |
artikel |
21 |
Preparation and Characterization of Ultrasonically Sprayed Zinc Oxide Thin Films Doped with Lithium
|
Bilgin, Vildan |
|
2009 |
38 |
9 |
p. 1969-1978 |
artikel |
22 |
p-Type PbTe Thermoelectric Bulk Materials with Nanograins Fabricated by Attrition Milling and Spark Plasma Sintering
|
Kuo, Chia-Hung |
|
2009 |
38 |
9 |
p. 1956-1961 |
artikel |
23 |
Rutherford Backscattering Spectrometry Analysis of Self-Formed Ti-Rich Interface Layer Growth in Cu(Ti)/Low-k Samples
|
Kohama, Kazuyuki |
|
2009 |
38 |
9 |
p. 1913-1920 |
artikel |
24 |
Silicon Nitride Films Deposited by RF Sputtering for Microstructure Fabrication in MEMS
|
Bhatt, Vivekanand |
|
2009 |
38 |
9 |
p. 1979-1989 |
artikel |
25 |
Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 1: Eutectic Lead Solder
|
Zhao, H. |
|
2009 |
38 |
9 |
p. 1838-1845 |
artikel |
26 |
Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 2: Lead-Free Solders
|
Zhao, H. |
|
2009 |
38 |
9 |
p. 1846-1854 |
artikel |
27 |
Study of Solidification Cracks in Sn-Ag-Cu Lead-Free Solder Joints
|
Dong, Wenxing |
|
2009 |
38 |
9 |
p. 1906-1912 |
artikel |
28 |
Synthesis and Characterization of Naphthalene End-Capped Divinylbenzene for OTFT
|
Park, Sung Jin |
|
2009 |
38 |
9 |
p. 2000-2005 |
artikel |
29 |
Two Layer Surface Exfoliation on Si3N4/Si by Sequential Implantation of He and H Ions
|
Li, Mengkai |
|
2009 |
38 |
9 |
p. 1990-1994 |
artikel |