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                             19 results found
no title author magazine year volume issue page(s) type
1 Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag Kim, Jung-Mo
2008
37 8 p. 1163
article
2 Characterization of Mg-Doped AlInN Annealed in Nitrogen and Oxygen Ambients Cheng, A.T.
2008
37 8 p. 1070-1075
article
3 Characterization of Self-Formed Ti-Rich Interface Layers in Cu(Ti)/Low-k Samples Kohama, Kazuyuki
2008
37 8 p. 1148-1157
article
4 Cleaved Mirrors for Nitride Semiconductor Lasers Chen, Wei-Li
2008
37 8 p. 1064-1069
article
5 Combined Use of Magnetic and Electrically Conductive Fillers in a Polymer Matrix for Electromagnetic Interference Shielding Wu, Junhua
2008
37 8 p. 1088-1094
article
6 Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions Jung, Ja-Young
2008
37 8 p. 1111-1118
article
7 Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates Zou, H.F.
2008
37 8 p. 1119-1129
article
8 Electrical Characteristics and Photoresponse of ZnO/ZnTe Heterojunction Diodes Wang, W.
2008
37 8 p. 1044-1048
article
9 Evaluation of Mn Uniformity in CdMnTe Crystal Grown by the Vertical Bridgman Method Zhang, Jijun
2008
37 8 p. 1158-1162
article
10 Field-Emission Performance of Wormhole-Like Mesoporous Tungsten Oxide Nanowires Lai, Wei Hao
2008
37 8 p. 1082-1087
article
11 Growth of GaN Nanowires on Epitaxial GaN Aurongzeb, D.
2008
37 8 p. 1076-1081
article
12 Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging Choubey, Anupam
2008
37 8 p. 1130-1138
article
13 MOCVD Growth of InN on Si(111) with Various Buffer Layers Huang, C.C.
2008
37 8 p. 1054-1057
article
14 Optical Properties of Nanocrystalline GaN Films Prepared by Annealing Amorphous GaN in Ammonia Zhang, Z.X.
2008
37 8 p. 1049-1053
article
15 Overshoot Graded Layers for Mismatched Heteroepitaxial Devices Ocampo, J.F.
2008
37 8 p. 1035-1043
article
16 Polarity Analysis of Self-Seeded Aluminum Nitride Crystals Grown by Sublimation Han, Qifeng
2008
37 8 p. 1058-1063
article
17 Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking Zhang, W.
2008
37 8 p. 1095-1101
article
18 Study on the Effects of Copper Oxide Growth on the Peel Strength of Copper/Polyimide Lee, H.J.
2008
37 8 p. 1102-1110
article
19 Three-Dimensional Finite Element Analysis of Multiple-Grained Lead-Free Solder Interconnects Park, Seungbae
2008
37 8 p. 1139-1147
article
                             19 results found
 
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