nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints
|
Lai, Yi-Shao |
|
2007 |
37 |
2 |
p. 201-209 |
artikel |
2 |
Deformation Behavior of Sn-3.8Ag-0.7Cu Solder at Intermediate Strain Rates: Effect of Microstructure and Test Conditions
|
Long, Xin |
|
2007 |
37 |
2 |
p. 189-200 |
artikel |
3 |
Density Functional Theory Modeling of (001)Si–Oxynitride Interfaces
|
Stefanou, Athanasios |
|
2007 |
37 |
2 |
p. 172-175 |
artikel |
4 |
Effect of Polyethylene Glycol Additives on Pulse Electroplating of SnAg Solder
|
Chen, Hsiao-Yun |
|
2007 |
37 |
2 |
p. 224-230 |
artikel |
5 |
Electrical Switching in TlSbSe2 Chalcogenide Semiconductors
|
Kalkan, N. |
|
2007 |
37 |
2 |
p. 157-160 |
artikel |
6 |
Fabrication and Properties of an Asymmetric Waveguide Containing Nanoparticles
|
Zhang, J.L. |
|
2007 |
37 |
2 |
p. 135-144 |
artikel |
7 |
Helium-Plasma-Prepared (111)A HgCdTe and (211)B InSb
|
Martinka, Michael |
|
2007 |
37 |
2 |
p. 152-156 |
artikel |
8 |
Improvement in Power Durability of Al Electrode Films Used in SAW Devices by Zr Additive and Ti Underlayer
|
Li, Dongmei |
|
2007 |
37 |
2 |
p. 180-184 |
artikel |
9 |
Investigation of Laser-Assisted Microcrystalline SiGe Films Deposited at Low Temperature
|
Lai, Li-Wen |
|
2007 |
37 |
2 |
p. 167-171 |
artikel |
10 |
Ir Diffusion Barriers in Ni/Au Ohmic Contacts to p-Type CuCrO2
|
Lim, W.T. |
|
2007 |
37 |
2 |
p. 161-166 |
artikel |
11 |
Preparation and Characterization of CdTe for Solar Cells, Detectors, and Related Thin-Film Materials
|
Abbas Shah, Nazar |
|
2007 |
37 |
2 |
p. 145-151 |
artikel |
12 |
Recent Observations on Tin Pest Formation in Solder Alloys
|
Plumbridge, W.J. |
|
2007 |
37 |
2 |
p. 218-223 |
artikel |
13 |
Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints
|
Jang, J.W. |
|
2007 |
37 |
2 |
p. 185-188 |
artikel |
14 |
Synthesis of Silicon Nanoneedles
|
Chen, Y.W. |
|
2007 |
37 |
2 |
p. 176-179 |
artikel |
15 |
Thermodynamic Assessments of the Ag-Ni Binary and Ag-Cu-Ni Ternary Systems
|
Liu, Xing Jun |
|
2007 |
37 |
2 |
p. 210-217 |
artikel |