| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Preliminary Electron Backscatter Diffraction Study of Microstructures and Microtextures Evolution during Au Stud and Flip Chip Thermosonic Bonding
|
Li, Chun-Mei
|
|
2007
|
36 |
5 |
p. 587-592
|
artikel
|
| 2 |
Barrier Properties of Amorphous Binary Ta-Ni Thin Films for Cu Interconnection
|
Fang, J.S.
|
|
2007
|
36 |
5 |
p. 614-622
|
artikel
|
| 3 |
Characteristics of Dislocation Half-Loop Arrays in 4H-SiC Homo-Epilayer
|
Zhang, Z.
|
|
2007
|
36 |
5 |
p. 539-542
|
artikel
|
| 4 |
Effects of Substrate Materials on Self-Formation of Ti-Rich Interface Layers in Cu(Ti) Alloy Films
|
Ito, K.
|
|
2007
|
36 |
5 |
p. 606-613
|
artikel
|
| 5 |
High Performance Nonconductive Film with π-Conjugated Self-Assembled Molecular Wires for Fine Pitch Interconnect Applications
|
Li, Yi
|
|
2007
|
36 |
5 |
p. 549-554
|
artikel
|
| 6 |
In-Situ Observation of Electromigration in Eutectic SnPb Solder Lines: Atomic Migration and Hillock Formation
|
Yoon, Min-Seung
|
|
2007
|
36 |
5 |
p. 562-567
|
artikel
|
| 7 |
Interfacial Reactions between CuxNiy Alloy Underbump Metallurgy and Sn-Ag-zCu Solders
|
HAN, H.
|
|
2007
|
36 |
5 |
p. 578-586
|
artikel
|
| 8 |
Magnetic Nanocomposite for Potential Ultrahigh Frequency Microelectronic Application
|
Dong, Hai
|
|
2007
|
36 |
5 |
p. 593-597
|
artikel
|
| 9 |
Measurement of Small Specific Contact Resistance of Metals with Resistive Semiconductors
|
Deepak,
|
|
2007
|
36 |
5 |
p. 598-605
|
artikel
|
| 10 |
Migration, Formation, and Growth of Pure Cd Whiskers in Cd-Based Compounds
|
Wu, D.
|
|
2007
|
36 |
5 |
p. 555-561
|
artikel
|
| 11 |
Strategies to Improve Field Emission Performance of Nanostructural ZnO
|
Xu, C. X.
|
|
2007
|
36 |
5 |
p. 543-548
|
artikel
|
| 12 |
Thermodynamic Modeling of the Au-Bi-Sb Ternary System
|
Wang, J.
|
|
2007
|
36 |
5 |
p. 568-577
|
artikel
|
Tijdschrift beschrijving