nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Authors' biographies
|
|
|
1995 |
49 |
1-2 |
p. 178-182 5 p. |
artikel |
2 |
Direct bonding: From an optical technology to a broad research topic
|
Biermann, U.K.P. |
|
1995 |
49 |
1-2 |
p. 1-10 10 p. |
artikel |
3 |
Direct bonding in patent literature
|
Haisma, Jan |
|
1995 |
49 |
1-2 |
p. 165-170 6 p. |
artikel |
4 |
Direct bonding of organic polymeric materials
|
Spierings, G.A.C.M. |
|
1995 |
49 |
1-2 |
p. 139-149 11 p. |
artikel |
5 |
Direct bonding: retrospect and outlook
|
Haisma, Jan |
|
1995 |
49 |
1-2 |
p. 171-177 7 p. |
artikel |
6 |
Evaluation of strain sources in bond and etchback silicon-on-insulator
|
Egloff, R. |
|
1995 |
49 |
1-2 |
p. 125-138 14 p. |
artikel |
7 |
Evaluation of wafer bonding and etch back for SOI technology
|
Baumgart, Helmut |
|
1995 |
49 |
1-2 |
p. 91-124 34 p. |
artikel |
8 |
Frameworks for direct bonding
|
Haisma, Jan |
|
1995 |
49 |
1-2 |
p. 11-21 11 p. |
artikel |
9 |
Non-silicon applications of direct bonding
|
Haisma, Jan |
|
1995 |
49 |
1-2 |
p. 151-163 13 p. |
artikel |
10 |
Silicon-wafer fabrication and (potential) applications of direct-bonded silicon
|
Haisma, Jan |
|
1995 |
49 |
1-2 |
p. 65-89 25 p. |
artikel |
11 |
Surface preparation and phenomenological aspects of direct bonding
|
Haisma, Jan |
|
1995 |
49 |
1-2 |
p. 23-46 24 p. |
artikel |
12 |
Surface-related phenomena in the direct bonding of silicon and fused-silica wafer pairs
|
Spierings, G.A.C.M. |
|
1995 |
49 |
1-2 |
p. 47-63 17 p. |
artikel |