| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A disruptive technology for thermal to electrical energy conversion
|
Puscasu, O.
|
|
|
45 |
5 |
p. 554-558
|
artikel
|
| 2 |
Editorial board
|
|
|
|
45 |
5 |
p. i
|
artikel
|
| 3 |
Electro-thermal characterization of a differential temperature sensor in a 65nm CMOS IC: Applications to gain monitoring in RF amplifiers
|
Altet, Josep
|
|
|
45 |
5 |
p. 484-490
|
artikel
|
| 4 |
Electro-thermal high-level modeling of integrated circuits
|
Krencker, J.C.
|
|
|
45 |
5 |
p. 491-499
|
artikel
|
| 5 |
Heat spreading in a thin longitudinal fin
|
Luiten, G.A.
|
|
|
45 |
5 |
p. 539-546
|
artikel
|
| 6 |
Investigation of the thermal properties of thin solid materials at different temperature levels using a set of microresistors
|
Assy, Ali
|
|
|
45 |
5 |
p. 508-514
|
artikel
|
| 7 |
Minimizing thermally induced interfacial shearing stress in a thermoelectric module with low fractional area coverage
|
Ziabari, Amirkoushyar
|
|
|
45 |
5 |
p. 547-553
|
artikel
|
| 8 |
Row-based body-bias assignment for dynamic thermal clock-skew compensation
|
Tenace, Valerio
|
|
|
45 |
5 |
p. 530-538
|
artikel
|
| 9 |
Temperature dependent timing in standard cell designs
|
Timar, Andras
|
|
|
45 |
5 |
p. 521-529
|
artikel
|
| 10 |
Thermal investigations of integrated circuits in systems at THERMINIC 2012
|
Raad, Peter E.
|
|
|
45 |
5 |
p. 483
|
artikel
|
| 11 |
Thermal sensor allocation for 3DICs using three dimensional thermal sensors
|
Kashfi, Fatemeh
|
|
|
45 |
5 |
p. 500-507
|
artikel
|
| 12 |
Thermoreflectance temperature measurements for optically emitting devices
|
Raad, Peter E.
|
|
|
45 |
5 |
p. 515-520
|
artikel
|
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