| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A comparison of thin film microrefrigerators based on Si/SiGe superlattice and bulk SiGe
|
Ezzahri, Y.
|
|
|
39 |
7 |
p. 981-991
|
artikel
|
| 2 |
Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling
|
Oprins, H.
|
|
|
39 |
7 |
p. 966-974
|
artikel
|
| 3 |
Editorial board
|
|
|
|
39 |
7 |
p. i
|
artikel
|
| 4 |
Energy minimization-based analysis of electrowetting for microelectronics cooling applications
|
Bahadur, V.
|
|
|
39 |
7 |
p. 957-965
|
artikel
|
| 5 |
Flow boiling of FC-72 from a screen laminate extended surface matrix
|
Holland, B.
|
|
|
39 |
7 |
p. 1001-1007
|
artikel
|
| 6 |
Force-fed evaporation and condensation utilizing advanced micro-structured surfaces and micro-channels
|
Baummer, Thomas
|
|
|
39 |
7 |
p. 975-980
|
artikel
|
| 7 |
Improved compact thermal model for studying 3-D interconnect structures with low-k dielectrics
|
Whelan, A.
|
|
|
39 |
7 |
p. 1016-1022
|
artikel
|
| 8 |
[No title]
|
Garimella, Suresh V.
|
|
|
39 |
7 |
p. 929
|
artikel
|
| 9 |
One-dimensional thin-film phonon transport with generation
|
Bulusu, A.
|
|
|
39 |
7 |
p. 950-956
|
artikel
|
| 10 |
Platform wide innovations to overcome thermal challenges
|
Yavatkar, Raj
|
|
|
39 |
7 |
p. 930-941
|
artikel
|
| 11 |
Skin cooling and other challenges in future mobile form factor computing devices
|
Mongia, Rajiv
|
|
|
39 |
7 |
p. 992-1000
|
artikel
|
| 12 |
Strategies for effective use of exergy-based modeling of data center thermal management systems
|
McAllister, Sara
|
|
|
39 |
7 |
p. 1023-1029
|
artikel
|
| 13 |
Thermal challenges deriving from the advances of display technologies
|
Kubota, S.
|
|
|
39 |
7 |
p. 942-949
|
artikel
|
| 14 |
Thermal characterization of embedded electronic features by an integrated system of CCD thermography and self-adaptive numerical modeling
|
Raad, Peter E.
|
|
|
39 |
7 |
p. 1008-1015
|
artikel
|
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