nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A comparison of thin film microrefrigerators based on Si/SiGe superlattice and bulk SiGe
|
Ezzahri, Y. |
|
|
39 |
7 |
p. 981-991 |
artikel |
2 |
Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling
|
Oprins, H. |
|
|
39 |
7 |
p. 966-974 |
artikel |
3 |
Editorial board
|
|
|
|
39 |
7 |
p. i |
artikel |
4 |
Energy minimization-based analysis of electrowetting for microelectronics cooling applications
|
Bahadur, V. |
|
|
39 |
7 |
p. 957-965 |
artikel |
5 |
Flow boiling of FC-72 from a screen laminate extended surface matrix
|
Holland, B. |
|
|
39 |
7 |
p. 1001-1007 |
artikel |
6 |
Force-fed evaporation and condensation utilizing advanced micro-structured surfaces and micro-channels
|
Baummer, Thomas |
|
|
39 |
7 |
p. 975-980 |
artikel |
7 |
Improved compact thermal model for studying 3-D interconnect structures with low-k dielectrics
|
Whelan, A. |
|
|
39 |
7 |
p. 1016-1022 |
artikel |
8 |
[No title]
|
Garimella, Suresh V. |
|
|
39 |
7 |
p. 929 |
artikel |
9 |
One-dimensional thin-film phonon transport with generation
|
Bulusu, A. |
|
|
39 |
7 |
p. 950-956 |
artikel |
10 |
Platform wide innovations to overcome thermal challenges
|
Yavatkar, Raj |
|
|
39 |
7 |
p. 930-941 |
artikel |
11 |
Skin cooling and other challenges in future mobile form factor computing devices
|
Mongia, Rajiv |
|
|
39 |
7 |
p. 992-1000 |
artikel |
12 |
Strategies for effective use of exergy-based modeling of data center thermal management systems
|
McAllister, Sara |
|
|
39 |
7 |
p. 1023-1029 |
artikel |
13 |
Thermal challenges deriving from the advances of display technologies
|
Kubota, S. |
|
|
39 |
7 |
p. 942-949 |
artikel |
14 |
Thermal characterization of embedded electronic features by an integrated system of CCD thermography and self-adaptive numerical modeling
|
Raad, Peter E. |
|
|
39 |
7 |
p. 1008-1015 |
artikel |