| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A study of temperature field in a GaN heterostructure field-effect transistor
|
Baig, M.A.
|
|
|
34 |
3 |
p. 207-214
|
artikel
|
| 2 |
Dynamics of a liquid plug in a capillary duct powered by vapor explosion
|
Suzuki, Osamu
|
|
|
34 |
3 |
p. 195-200
|
artikel
|
| 3 |
Editorial Board
|
|
|
|
34 |
3 |
p. i
|
artikel
|
| 4 |
Evaluation of analytical models for thermal analysis and design of electronic packages
|
Moghaddam, S.
|
|
|
34 |
3 |
p. 223-230
|
artikel
|
| 5 |
Innovative wick design for multi-source, flat plate heat pipes
|
Rightley, M.J
|
|
|
34 |
3 |
p. 187-194
|
artikel
|
| 6 |
New possibilities in the thermal evaluation, offered by transient testing
|
Rencz, Marta
|
|
|
34 |
3 |
p. 171-177
|
artikel
|
| 7 |
Nonequilibrium electron and phonon transport and energy conversion in heterostructures
|
Zeng, Taofang
|
|
|
34 |
3 |
p. 201-206
|
artikel
|
| 8 |
Performance and testing of thermal interface materials
|
Gwinn, J.P
|
|
|
34 |
3 |
p. 215-222
|
artikel
|
| 9 |
Thermal challenges in MEMS applications: phase change phenomena and thermal bonding processes
|
Lin, Liwei
|
|
|
34 |
3 |
p. 179-185
|
artikel
|
| 10 |
Thermal challenges in next generation electronic systems
|
Joshi, Yogendra K
|
|
|
34 |
3 |
p. 169
|
artikel
|
Tijdschrift beschrijving