| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A lumped transient thermal model for self-heating in MOSFETs
|
Sabry, M.N.
|
|
|
32 |
10-11 |
p. 847-853
|
artikel
|
| 2 |
A programmable thermal management interface circuit for PowerPC systems
|
Chiueh, Herming
|
|
|
32 |
10-11 |
p. 875-881
|
artikel
|
| 3 |
Challenges in thermal modeling of electronics at the system level: summary of panel held at the Therminic 2000
|
Joshi, Y
|
|
|
32 |
10-11 |
p. 797-800
|
artikel
|
| 4 |
Exploiting electrothermal oscillations for identifying MOSFET thermal parameters
|
Storti-Gajani, Giancarlo
|
|
|
32 |
10-11 |
p. 883-889
|
artikel
|
| 5 |
Fuzzy thermal modeling for MCM placement
|
Huang, Yu-Jung
|
|
|
32 |
10-11 |
p. 863-868
|
artikel
|
| 6 |
Influence of high-level synthesis on average and peak temperatures of CMOS circuits
|
Szczesniak, Wladyslaw
|
|
|
32 |
10-11 |
p. 855-862
|
artikel
|
| 7 |
Laser diode light efficiency determination by thermoreflectance microscopy
|
Dilhaire, Stefan
|
|
|
32 |
10-11 |
p. 899-901
|
artikel
|
| 8 |
Laser probes for the thermal and thermomechanical characterisation of microelectronic devices
|
Claeys, Wilfrid
|
|
|
32 |
10-11 |
p. 891-898
|
artikel
|
| 9 |
MOSFET-based temperature sensor for standard BCD smart power technology
|
Miribel-Català, P.
|
|
|
32 |
10-11 |
p. 869-873
|
artikel
|
| 10 |
[No title]
|
Székely, V.
|
|
|
32 |
10-11 |
p. 795-796
|
artikel
|
| 11 |
Optimal Reliability Design: Fundamentals and Applications
|
Saidane, A.
|
|
|
32 |
10-11 |
p. 911
|
artikel
|
| 12 |
Optimized electrothermal design of integrated devices through the solution to the non-linear 3-D heat flow equation
|
Pesare, Marcello
|
|
|
32 |
10-11 |
p. 823-831
|
artikel
|
| 13 |
Parametric compact models for the 72-pins polymer stud grid array™
|
Driessens, Evelien
|
|
|
32 |
10-11 |
p. 839-846
|
artikel
|
| 14 |
PatentsALERT
|
|
|
|
32 |
10-11 |
p. 913-923
|
artikel
|
| 15 |
Photoacoustic studies of Zn1−x Be x Se mixed crystals: two-layer approach
|
Maliński, M.
|
|
|
32 |
10-11 |
p. 903-910
|
artikel
|
| 16 |
Thermal modelling of semiconductor packages
|
Franke, T
|
|
|
32 |
10-11 |
p. 809-816
|
artikel
|
| 17 |
Thermal networks for electro-thermal analysis of power devices
|
Codecasa, Lorenzo
|
|
|
32 |
10-11 |
p. 817-822
|
artikel
|
| 18 |
Thermomechanical analysis of hotplates by FEM
|
Vı́zváry, Zs.
|
|
|
32 |
10-11 |
p. 833-837
|
artikel
|
| 19 |
Time dependent temperature fields calculated using eigenfunctions and eigenvalues of the heat conduction equation
|
Gerstenmaier, Y.C.
|
|
|
32 |
10-11 |
p. 801-808
|
artikel
|
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