nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A method for tightly coupled thermal-electrical simulation
|
Klaassen, Bernhard |
|
|
28 |
3 |
p. 239-245 |
artikel |
2 |
Analysis of laser diode thermal properties with spatial resolution by means of the TRAIT method
|
Oliveti, G. |
|
|
28 |
3 |
p. 293-300 |
artikel |
3 |
A new evaluation method of thermal transient measurement results
|
Székely, V. |
|
|
28 |
3 |
p. 277-292 |
artikel |
4 |
An interactive and integrated thermal characterization of component placement on a printed circuit board
|
Blanchard, Jean-Louis |
|
|
28 |
3 |
p. 209-219 |
artikel |
5 |
Application of computer-based thermography to thermal measurements of integrated circuits and power devices
|
Grecki, M. |
|
|
28 |
3 |
p. 337-347 |
artikel |
6 |
ASM Lithography (ASML) and IMEC launch joint development program in 193-nm-wavelength deep UV lithographic technology
|
|
|
|
28 |
3 |
p. iv |
artikel |
7 |
A transient method of thermal characterization of double heterostructure laser diodes
|
Lepaludier, V. |
|
|
28 |
3 |
p. 301-312 |
artikel |
8 |
Author index
|
|
|
|
28 |
3 |
p. 357 |
artikel |
9 |
Beating vibration problems in a clean room environment
|
|
|
|
28 |
3 |
p. vii |
artikel |
10 |
Circuit, device and process simulation: Mathematical and numerical aspects
|
Mijalković, S. |
|
|
28 |
3 |
p. 364-365 |
artikel |
11 |
Compound and Josephson high-speed devices
|
Karamarković, J. |
|
|
28 |
3 |
p. 361-362 |
artikel |
12 |
CoWare nv, IMEC's spin-off company,plans to bring higher levels of design productivity to the emerging system-on-silicon market
|
|
|
|
28 |
3 |
p. xv-xvi |
artikel |
13 |
Cypress introduces the first deep synchronous FIFO to industry standard pinouts
|
|
|
|
28 |
3 |
p. v |
artikel |
14 |
Daimler-Benz heterostructural bipolar transistors
|
|
|
|
28 |
3 |
p. viii |
artikel |
15 |
Data visualization software helps engineers and scientists be more productive
|
|
|
|
28 |
3 |
p. xvii-xviii |
artikel |
16 |
Deep Si etch with ICP cryo-RIE
|
|
|
|
28 |
3 |
p. xxiv |
artikel |
17 |
Editorial
|
Gurnett, Keith |
|
|
28 |
3 |
p. i |
artikel |
18 |
Electro-thermal simulation and experimental detection of the hot spot onset in power bipolar transistors
|
Pica, S. |
|
|
28 |
3 |
p. 263-275 |
artikel |
19 |
Electro-thermal simulation: a realization by simultaneous iteration
|
Székely, V. |
|
|
28 |
3 |
p. 247-262 |
artikel |
20 |
Heat transport in masks for deep X-ray lithography during the irradiation process
|
Neumann, M. |
|
|
28 |
3 |
p. 349-355 |
artikel |
21 |
IBM Paris chooses Edwards for 16MB line
|
|
|
|
28 |
3 |
p. vii |
artikel |
22 |
New applications of advanced thin film measurement by Spectroscopic Ellipsometry
|
|
|
|
28 |
3 |
p. ix-xii |
artikel |
23 |
New backside technology breaks inspectability barrier for high speed devices
|
|
|
|
28 |
3 |
p. ii-iii |
artikel |
24 |
New ControlVision TMCTM controls software available for the Marathon series of cluster tool automation platforms
|
|
|
|
28 |
3 |
p. vi |
artikel |
25 |
Philips continues to pioneer USB technology with the launch of the USB hub IC
|
|
|
|
28 |
3 |
p. xiii-xiv |
artikel |
26 |
Philips new fab MOS4YOU
|
|
|
|
28 |
3 |
p. iii-iv |
artikel |
27 |
Physics of high-speed transistors
|
Karamarković, J. |
|
|
28 |
3 |
p. 360-361 |
artikel |
28 |
Principles and analysis of AlGaAs/GaAs heterojunction bipolar transistors
|
Harris, M.H. |
|
|
28 |
3 |
p. 362-363 |
artikel |
29 |
Semiconductor physical electronics
|
Mijalković, S. |
|
|
28 |
3 |
p. 363-364 |
artikel |
30 |
Semiconductor sensors
|
Janković, Nabojs̆a |
|
|
28 |
3 |
p. 360 |
artikel |
31 |
SRDC acquires Metaphase Technology Inc.
|
|
|
|
28 |
3 |
p. iv |
artikel |
32 |
Taxis by satellite
|
|
|
|
28 |
3 |
p. ii |
artikel |
33 |
Thermal characterization of microsystems by means of high-resolution thermography
|
Ashauer, M. |
|
|
28 |
3 |
p. 327-335 |
artikel |
34 |
Thermal investigation of monolithic structures
|
Kohári, Zs. |
|
|
28 |
3 |
p. 317-325 |
artikel |
35 |
Thermal investigations of ICs and microstructures
|
Székely, V. |
|
|
28 |
3 |
p. 205-207 |
artikel |
36 |
Thermal monitoring of a single heat source in semiconductor devices — the first approach
|
Wójciak, Wojciech |
|
|
28 |
3 |
p. 313-316 |
artikel |
37 |
Thermal simulation of semiconductor ICs: general and practical approach
|
Koval, Vladimir A. |
|
|
28 |
3 |
p. 221-227 |
artikel |
38 |
The SLAN - A new microwave plasma source
|
|
|
|
28 |
3 |
p. xix-xxiii |
artikel |
39 |
Two new contracts for Cognex
|
|
|
|
28 |
3 |
p. v-vi |
artikel |
40 |
Validation of numerical models of ceramic pin grid array packages
|
O'Flaherty, M. |
|
|
28 |
3 |
p. 229-238 |
artikel |
41 |
VLSI fabrication principles
|
Pantić, D. |
|
|
28 |
3 |
p. 359-360 |
artikel |