| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A methodology for estimating interconnect capacitance for signal propagation delay in VLSls
|
Gilligan, Margaret
|
|
|
26 |
4 |
p. 327-336
|
artikel
|
| 2 |
Electrooptics: Phenomena, materials and applications
|
Harris, M.S.
|
|
|
26 |
4 |
p. xxii-xxiii
|
artikel
|
| 3 |
Handbook of VLSI chip design and expert systems
|
Russell, G.
|
|
|
26 |
4 |
p. xxi
|
artikel
|
| 4 |
Hardware area estimator based on the SQP algorithm
|
Dlay, S.S.
|
|
|
26 |
4 |
p. 351-359
|
artikel
|
| 5 |
High-temperature characteristics of epitaxial high-low junction n+−n−p+ silicon diodes
|
Ang, S.S.
|
|
|
26 |
4 |
p. 375-382
|
artikel
|
| 6 |
I ddq Testing for CMOS VLSI
|
Milovanović, Draeiša P.
|
|
|
26 |
4 |
p. xxiii
|
artikel
|
| 7 |
Integrated optics: Design and modeling
|
Harris, M.S.
|
|
|
26 |
4 |
p. xxii
|
artikel
|
| 8 |
Modelling of interface carrier transport for device simulation
|
Mijalkovic, S.
|
|
|
26 |
4 |
p. xxiv
|
artikel
|
| 9 |
Motorola integrated wireless data solution
|
|
|
|
26 |
4 |
p. ix-x
|
artikel
|
| 10 |
National semiconductor “Hard disk on a chip”
|
|
|
|
26 |
4 |
p. v-viii
|
artikel
|
| 11 |
OptoplanarTM - QTC's revolutionary packaging technology
|
|
|
|
26 |
4 |
p. xiii-xvi
|
artikel
|
| 12 |
Pictures worth a thousand words?
|
Szweda, Roy
|
|
|
26 |
4 |
p. i-iii
|
artikel
|
| 13 |
Return to growth in the West European electronics markets
|
|
|
|
26 |
4 |
p. xvii-xviii
|
artikel
|
| 14 |
System specification through VHDL — a structured approach
|
Hallwood, Marcia
|
|
|
26 |
4 |
p. 337-350
|
artikel
|
| 15 |
The behaviour of flip-flops under different boundary conditions
|
Dudziak, Hilmar F.
|
|
|
26 |
4 |
p. 361-374
|
artikel
|
| 16 |
The design of Reed-Solomon codecs over the, dual basis
|
Fenn, S.T.J.
|
|
|
26 |
4 |
p. 383-391
|
artikel
|
| 17 |
Toshiba 9.5-in (24 cm) TFT LCD Claims to be Industry's smallest
|
|
|
|
26 |
4 |
p. xi
|
artikel
|
| 18 |
Tyrrell exploits military technology for racing gain
|
|
|
|
26 |
4 |
p. xix-xx
|
artikel
|
| 19 |
Ultra-fine feature printed circuits and multi-chip modules
|
Chandler, N.
|
|
|
26 |
4 |
p. 393-404
|
artikel
|
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