nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Advanced materials welcomed at IEDM
|
McDonald, Jo Ann |
|
|
26 |
2-3 |
p. xv-xviii |
artikel |
2 |
Algebraic microscopic approach to drift-diffusion
|
Orlowski, Marius |
|
|
26 |
2-3 |
p. 243-248 |
artikel |
3 |
Atomistic evaluation of diffusion theories for the diffusion of dopants in vacancy gradients
|
List, S. |
|
|
26 |
2-3 |
p. 261-264 |
artikel |
4 |
CAESAR: The virtual IC factory as an integrated TCAD user environment
|
Axelrad, V. |
|
|
26 |
2-3 |
p. 191-202 |
artikel |
5 |
Consistent treatment of carrier emission and capture kinetics in electrothermal and energy transport models
|
Wachutka, Gerhard |
|
|
26 |
2-3 |
p. 307-315 |
artikel |
6 |
Device modelling for the 1990s
|
Kosina, H. |
|
|
26 |
2-3 |
p. 217-233 |
artikel |
7 |
Electro-elastic simulation of a piezoresistive pressure sensor
|
Ciampolini, P. |
|
|
26 |
2-3 |
p. 265-272 |
artikel |
8 |
First international workshop on growth, characterization and exploitation of epitaxial III–V compound semiconductors on novel index surfaces, Trento (Italy), 4–7 December 1994
|
Henini, M. |
|
|
26 |
2-3 |
p. xix-xxiii |
artikel |
9 |
Guest editorial
|
Stojadinović, Ninoslav D. |
|
|
26 |
2-3 |
p. 77-78 |
artikel |
10 |
High speed semiconductor devices: Circuit aspects and fundamental behaviour
|
Henini, M. |
|
|
26 |
2-3 |
p. xxviii |
artikel |
11 |
High-speed VLSI interconnections: Modeling analysis and simulation
|
Harris, M.S. |
|
|
26 |
2-3 |
p. xxx |
artikel |
12 |
InP HBTs: Growth, processing and applications
|
Henini, M. |
|
|
26 |
2-3 |
p. xxviii-xxix |
artikel |
13 |
Introduction to neural networks
|
Hurst, S.L. |
|
|
26 |
2-3 |
p. xxx |
artikel |
14 |
Lifetime calculations of MOSFETs using depth-dependent non-local impact ionization
|
van Dort, M.J. |
|
|
26 |
2-3 |
p. 301-305 |
artikel |
15 |
Mechanical stress simulation during gate formation of MOS devices considering crystallization-induced stress of phosphorus-doped silicon thin films
|
Miura, Hideo |
|
|
26 |
2-3 |
p. 249-253 |
artikel |
16 |
Modelling high concentration boron diffusion with dynamic clustering: influence of the initial conditions
|
Baccus, Bruno |
|
|
26 |
2-3 |
p. 235-242 |
artikel |
17 |
MOSFET models for VLSI circuit simulation
|
Arora, N. |
|
|
26 |
2-3 |
p. xxvi-xxvii |
artikel |
18 |
Multigrid methods for process simulation
|
Joppich, W. |
|
|
26 |
2-3 |
p. xxvii-xxviii |
artikel |
19 |
News update
|
|
|
|
26 |
2-3 |
p. i-vii |
artikel |
20 |
NTT develops prototype nanostructure silicon single-electron transistor operating near room temperature
|
|
|
|
26 |
2-3 |
p. viii-x |
artikel |
21 |
Physical modelling of the enhanced diffusion of boron due to ion implantation in thin-base npn bipolar transistors
|
Mouis, M. |
|
|
26 |
2-3 |
p. 255-259 |
artikel |
22 |
Process simulation for the 1990s
|
Stippel, H. |
|
|
26 |
2-3 |
p. 203-215 |
artikel |
23 |
Properties of Group III nitrides
|
Henini, M. |
|
|
26 |
2-3 |
p. xxix-xxx |
artikel |
24 |
Technology CAD at AT&T
|
Lloyd, Peter |
|
|
26 |
2-3 |
p. 79-97 |
artikel |
25 |
Technology CAD at OKI
|
Ueda, J. |
|
|
26 |
2-3 |
p. 159-175 |
artikel |
26 |
Technology CAD at Stanford University: physics, algorithms, software and applications
|
Dutton, Robert W. |
|
|
26 |
2-3 |
p. 99-111 |
artikel |
27 |
The 1994 international conference on electronic materials (ICEM 94)
|
Tu, Charles W. |
|
|
26 |
2-3 |
p. xi-xiii |
artikel |
28 |
The MASTER Framework
|
Hopper, Peter J. |
|
|
26 |
2-3 |
p. 177-190 |
artikel |
29 |
The stationary semiconductor device equations
|
Markowich, P.A. |
|
|
26 |
2-3 |
p. xxv-xxvi |
artikel |
30 |
The STORM technology CAD system
|
Lorenz, J. |
|
|
26 |
2-3 |
p. 113-135 |
artikel |
31 |
The Viennese integrated system for technology CAD applications
|
Halama, S. |
|
|
26 |
2-3 |
p. 137-158 |
artikel |
32 |
Three-dimensional implementation of a unified transport model
|
Pierantoni, A. |
|
|
26 |
2-3 |
p. 287-300 |
artikel |
33 |
Two-dimensional numerical simulations of high-efficiency silicon solar cells
|
Heiser, G. |
|
|
26 |
2-3 |
p. 273-286 |
artikel |