nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A comparison between microwave reflectance, thermal wave modulated reflectance and defect etching for detecting transition metals in silicon
|
Sparks, D.R. |
|
|
23 |
4 |
p. 283-290 |
artikel |
2 |
A linearized source-coupled pair with a dynamic bias current
|
Wang, Zhenhua |
|
|
23 |
4 |
p. 301-304 |
artikel |
3 |
Assessing fault model and test quality
|
|
|
|
23 |
4 |
p. 319 |
artikel |
4 |
BiCMOS/CMOS system design
|
|
|
|
23 |
4 |
p. 315-316 |
artikel |
5 |
Economics of semi-conductor production
|
Penn, Malcolm |
|
|
23 |
4 |
p. 255-265 |
artikel |
6 |
Editorial
|
Hurst, Stanley L. |
|
|
23 |
4 |
p. 239-240 |
artikel |
7 |
Effective buffer insertion of clock tree for high-speed VLSI circuits
|
Wu, Bo |
|
|
23 |
4 |
p. 291-300 |
artikel |
8 |
Forthcoming events
|
|
|
|
23 |
4 |
p. 266 |
artikel |
9 |
Growth of thin thermal silicon dioxide films with low defect density
|
Singh, R. |
|
|
23 |
4 |
p. 273-281 |
artikel |
10 |
Hardware design and simulation in VAL/VHDL
|
|
|
|
23 |
4 |
p. 316 |
artikel |
11 |
Japanese news round-up
|
|
|
|
23 |
4 |
p. 241-244 |
artikel |
12 |
Laser interconnection techniques for defect avoidance in large-area restructurable silicon systems
|
Chapman, G.H. |
|
|
23 |
4 |
p. 267-272 |
artikel |
13 |
Low voltage CMOS — Having your cake and eating it?
|
Szweda, Roy |
|
|
23 |
4 |
p. 245-247 |
artikel |
14 |
Parallel algorithms and architectures for DSP applications
|
|
|
|
23 |
4 |
p. 318-319 |
artikel |
15 |
Patent survey on microelectronics
|
Terpstra, Marten |
|
|
23 |
4 |
p. 251-254 |
artikel |
16 |
Recent advances in IR detector technology
|
Piotrowski, Jozef |
|
|
23 |
4 |
p. 305-313 |
artikel |
17 |
Successful ASIC design the first time through
|
|
|
|
23 |
4 |
p. 315 |
artikel |
18 |
The verilog hardware description language
|
|
|
|
23 |
4 |
p. 316-317 |
artikel |
19 |
USA report: multi-chip modules— Really in business?
|
McDonald, Jo Ann |
|
|
23 |
4 |
p. 248-250 |
artikel |
20 |
VLSI design techniques for analog and digital circuits
|
|
|
|
23 |
4 |
p. 317-318 |
artikel |