| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Amorphous semiconductor technologies and devices
|
Bathaei, F.Z.
|
|
|
20 |
3 |
p. 53-54
|
artikel
|
| 2 |
16-Bit microprocessors
|
Seals, R.
|
|
|
20 |
3 |
p. 54
|
artikel
|
| 3 |
Characterisation of large area devices by an improved constant capacitance voltage transient technique
|
|
|
|
20 |
3 |
p. 49
|
artikel
|
| 4 |
Editorial
|
|
|
|
20 |
3 |
p. iv
|
artikel
|
| 5 |
Forthcoming events
|
|
|
|
20 |
3 |
p. 60
|
artikel
|
| 6 |
High-density interconnects for electronic packaging
|
|
|
|
20 |
3 |
p. 51
|
artikel
|
| 7 |
High frequency hybrid integrated circuits
|
|
|
|
20 |
3 |
p. 51
|
artikel
|
| 8 |
High performance cooling systems for advanced semiconductor equipment
|
|
|
|
20 |
3 |
p. 49
|
artikel
|
| 9 |
High reliability silver paste for die bonding
|
|
|
|
20 |
3 |
p. 50
|
artikel
|
| 10 |
HIMAT-1 automatic test system for hybrid circuits
|
|
|
|
20 |
3 |
p. 51
|
artikel
|
| 11 |
Human contamination as a source of IC failures
|
Brenman, M.
|
|
|
20 |
3 |
p. 43-47
|
artikel
|
| 12 |
Impact of residue on Al/Si pads on gold bonding
|
|
|
|
20 |
3 |
p. 50
|
artikel
|
| 13 |
Japanese hybrid microcircuit manufacturers face a tough road ahead
|
|
|
|
20 |
3 |
p. 51
|
artikel
|
| 14 |
Laser processing for interconnect technology
|
|
|
|
20 |
3 |
p. 52
|
artikel
|
| 15 |
Microprocessor architecture and design for gallium arsenide technology (part 2)
|
Milutinović, Veljko
|
|
|
20 |
3 |
p. 7-9
|
artikel
|
| 16 |
Multilayer thin-film substrate for multichip packaging
|
|
|
|
20 |
3 |
p. 52
|
artikel
|
| 17 |
Multiplexing input options of VLSI circuits implemented in four-phase dynamic logic technology
|
Patel, D.C.
|
|
|
20 |
3 |
p. 1-6
|
artikel
|
| 18 |
New film-type die attach adhesives
|
|
|
|
20 |
3 |
p. 50
|
artikel
|
| 19 |
Nonlinear distortion due to early voltage effect in the current source transistors of bipolar transconductance stages
|
Abuelma'atti, Muhammad Taher
|
|
|
20 |
3 |
p. 11-18
|
artikel
|
| 20 |
Optical-beam-induced current measurements in semiconductor devices
|
|
|
|
20 |
3 |
p. 49
|
artikel
|
| 21 |
Physical properties of ceramic-glass-copper micro-interconnect systems for VLSI/VHSIC packaging applications
|
|
|
|
20 |
3 |
p. 52
|
artikel
|
| 22 |
Platinum wire wedge bonding: a new IC and microsensor interconnect
|
|
|
|
20 |
3 |
p. 50
|
artikel
|
| 23 |
Properties of gallium arsenide (1986)
|
Patel, C.J.
|
|
|
20 |
3 |
p. 53
|
artikel
|
| 24 |
Protection of thyristors against overvoltage with breakover diodes
|
|
|
|
20 |
3 |
p. 49
|
artikel
|
| 25 |
Research and development
|
|
|
|
20 |
3 |
p. 56-59
|
artikel
|
| 26 |
Silver-glass die attach and large-area dice
|
|
|
|
20 |
3 |
p. 50
|
artikel
|
| 27 |
Structural distortion and the effect of bake-before-development in a negative photoresist process
|
Mehta, Rajesh
|
|
|
20 |
3 |
p. 19-25
|
artikel
|
| 28 |
Study of reaction kinetics for titanium disilicide formation by evaporated titanium on silicon
|
Singh, Awatar
|
|
|
20 |
3 |
p. 27-37
|
artikel
|
| 29 |
Surface fundamentals in microprocessors controlled systems
|
Seals, R.
|
|
|
20 |
3 |
p. 55
|
artikel
|
| 30 |
The development of new copper ball bonding-wire
|
|
|
|
20 |
3 |
p. 51
|
artikel
|
| 31 |
The “hedgehog” shape of an ESD failure
|
Brenman, M.
|
|
|
20 |
3 |
p. 39-41
|
artikel
|
| 32 |
Thermosonic gold-wire bonding to precious-metal-free copper lead-frames
|
|
|
|
20 |
3 |
p. 51
|
artikel
|
| 33 |
Thin-film silicon multichip technology
|
|
|
|
20 |
3 |
p. 52
|
artikel
|
| 34 |
Ultra-reliable packaging for silicon-on-silicon WSI
|
|
|
|
20 |
3 |
p. 52
|
artikel
|
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