nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Amorphous semiconductor technologies and devices
|
Bathaei, F.Z. |
|
1989 |
20 |
3 |
p. 53-54 2 p. |
artikel |
2 |
16-Bit microprocessors
|
Seals, R. |
|
1989 |
20 |
3 |
p. 54- 1 p. |
artikel |
3 |
Characterisation of large area devices by an improved constant capacitance voltage transient technique
|
|
|
1989 |
20 |
3 |
p. 49- 1 p. |
artikel |
4 |
Editorial
|
|
|
1989 |
20 |
3 |
p. iv- 1 p. |
artikel |
5 |
Forthcoming events
|
|
|
1989 |
20 |
3 |
p. 60- 1 p. |
artikel |
6 |
High-density interconnects for electronic packaging
|
|
|
1989 |
20 |
3 |
p. 51- 1 p. |
artikel |
7 |
High frequency hybrid integrated circuits
|
|
|
1989 |
20 |
3 |
p. 51- 1 p. |
artikel |
8 |
High performance cooling systems for advanced semiconductor equipment
|
|
|
1989 |
20 |
3 |
p. 49- 1 p. |
artikel |
9 |
High reliability silver paste for die bonding
|
|
|
1989 |
20 |
3 |
p. 50- 1 p. |
artikel |
10 |
HIMAT-1 automatic test system for hybrid circuits
|
|
|
1989 |
20 |
3 |
p. 51- 1 p. |
artikel |
11 |
Human contamination as a source of IC failures
|
Brenman, M. |
|
1989 |
20 |
3 |
p. 43-47 5 p. |
artikel |
12 |
Impact of residue on Al/Si pads on gold bonding
|
|
|
1989 |
20 |
3 |
p. 50- 1 p. |
artikel |
13 |
Japanese hybrid microcircuit manufacturers face a tough road ahead
|
|
|
1989 |
20 |
3 |
p. 51- 1 p. |
artikel |
14 |
Laser processing for interconnect technology
|
|
|
1989 |
20 |
3 |
p. 52- 1 p. |
artikel |
15 |
Microprocessor architecture and design for gallium arsenide technology (part 2)
|
Milutinović, Veljko |
|
1989 |
20 |
3 |
p. 7-9 3 p. |
artikel |
16 |
Multilayer thin-film substrate for multichip packaging
|
|
|
1989 |
20 |
3 |
p. 52- 1 p. |
artikel |
17 |
Multiplexing input options of VLSI circuits implemented in four-phase dynamic logic technology
|
Patel, D.C. |
|
1989 |
20 |
3 |
p. 1-6 6 p. |
artikel |
18 |
New film-type die attach adhesives
|
|
|
1989 |
20 |
3 |
p. 50- 1 p. |
artikel |
19 |
Nonlinear distortion due to early voltage effect in the current source transistors of bipolar transconductance stages
|
Abuelma'atti, Muhammad Taher |
|
1989 |
20 |
3 |
p. 11-18 8 p. |
artikel |
20 |
Optical-beam-induced current measurements in semiconductor devices
|
|
|
1989 |
20 |
3 |
p. 49- 1 p. |
artikel |
21 |
Physical properties of ceramic-glass-copper micro-interconnect systems for VLSI/VHSIC packaging applications
|
|
|
1989 |
20 |
3 |
p. 52- 1 p. |
artikel |
22 |
Platinum wire wedge bonding: a new IC and microsensor interconnect
|
|
|
1989 |
20 |
3 |
p. 50- 1 p. |
artikel |
23 |
Properties of gallium arsenide (1986)
|
Patel, C.J. |
|
1989 |
20 |
3 |
p. 53- 1 p. |
artikel |
24 |
Protection of thyristors against overvoltage with breakover diodes
|
|
|
1989 |
20 |
3 |
p. 49- 1 p. |
artikel |
25 |
Research and development
|
|
|
1989 |
20 |
3 |
p. 56-59 4 p. |
artikel |
26 |
Silver-glass die attach and large-area dice
|
|
|
1989 |
20 |
3 |
p. 50- 1 p. |
artikel |
27 |
Structural distortion and the effect of bake-before-development in a negative photoresist process
|
Mehta, Rajesh |
|
1989 |
20 |
3 |
p. 19-25 7 p. |
artikel |
28 |
Study of reaction kinetics for titanium disilicide formation by evaporated titanium on silicon
|
Singh, Awatar |
|
1989 |
20 |
3 |
p. 27-37 11 p. |
artikel |
29 |
Surface fundamentals in microprocessors controlled systems
|
Seals, R. |
|
1989 |
20 |
3 |
p. 55- 1 p. |
artikel |
30 |
The development of new copper ball bonding-wire
|
|
|
1989 |
20 |
3 |
p. 51- 1 p. |
artikel |
31 |
The “hedgehog” shape of an ESD failure
|
Brenman, M. |
|
1989 |
20 |
3 |
p. 39-41 3 p. |
artikel |
32 |
Thermosonic gold-wire bonding to precious-metal-free copper lead-frames
|
|
|
1989 |
20 |
3 |
p. 51- 1 p. |
artikel |
33 |
Thin-film silicon multichip technology
|
|
|
1989 |
20 |
3 |
p. 52- 1 p. |
artikel |
34 |
Ultra-reliable packaging for silicon-on-silicon WSI
|
|
|
1989 |
20 |
3 |
p. 52- 1 p. |
artikel |