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                             52 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A low-leakage VLSI CMOS/SOS process with thin epilayers
17 2 p. 47
 artikel
2 Aluminium wire for thermosonic ball bonding in semiconductor devices
17 2 p. 46
 artikel
3 Amstrad PCW 8256
17 2 p. 45
 artikel
4 Analysis of leakage currents in CMOS/SOS devices
17 2 p. 49-50
 artikel
5 An analytical method for determining intrinsic drain/source resistance of lightly doped drain (LDD) devices
17 2 p. 50
 artikel
6 A new chip carrier for high performance applications: integrated decoupling capacitor chip carrier (IDCCC)
17 2 p. 46-47
 artikel
7 A process-compatible electron beam direct write system
17 2 p. 49
 artikel
8 A process for two-layer gold IC metalization
17 2 p. 47
 artikel
9 Assessing the joints in Surface-Mounted assemblies Sinnadurai, Nihal
17 2 p. 21-31
 artikel
10 A strategy for rule verification shrinks LSI layouts
17 2 p. 50
 artikel
11 Book review Hurst, S.L.
17 2 p. 37
 artikel
12 Book review Bayford, Richard
17 2 p. 37-38
 artikel
13 Can computers crack the language Barrier
17 2 p. 45
 artikel
14 Characterization of ion implanted silicon—applications for IC process control
17 2 p. 48
 artikel
15 Current methods for silicon wafer characterization
17 2 p. 49
 artikel
16 Current titles
17 2 p. 40
 artikel
17 Designing and manufacturing Surface Mount Assemblies Gunther, Elizabeth
17 2 p. 13-20
 artikel
18 Designing solder paste materials to attach surface mounted devices
17 2 p. 47
 artikel
19 Failure physics of integrated circuits—a review
17 2 p. 50
 artikel
20 Final version
17 2 p. 45
 artikel
21 Forthcoming events
17 2 p. 51-54
 artikel
22 Guest Editorial Boswell, David
17 2 p. 3-4
 artikel
23 Handbook of microelectronics packaging and interconnection technologies
17 2 p. 32
 artikel
24 High thermal conduction package technology for flip chip devices
17 2 p. 46
 artikel
25 High throughput variable shaped electron beam lithography
17 2 p. 49
 artikel
26 Microelectronics into the 90's
17 2 p. 55-64
 artikel
27 Modelling of integrated circuit defect sensitivities
17 2 p. 49
 artikel
28 Novel IC metallization test structures for drop-in process monitors
17 2 p. 50
 artikel
29 Parametric test system update
17 2 p. 50
 artikel
30 Precision fineness of grind measurement—techniques and instrumentation—for thick film pastes
17 2 p. 47
 artikel
31 Production of hybrid circuits and quality assurance
17 2 p. 46
 artikel
32 Profile of the worldwide Semiconductor Industry
17 2 p. 54
 artikel
33 Quality solder paste systems for use in microelectronic applications
17 2 p. 47
 artikel
34 Radiation annealing of epitaxial silver films
17 2 p. 48
 artikel
35 Reading and writing the electronic book
17 2 p. 46
 artikel
36 Recent developments in the characteristics of semiconductors by transport measurements
17 2 p. 49
 artikel
37 Research and Development
17 2 p. 41-44
 artikel
38 Semiconductor evaluation techniques
17 2 p. 44
 artikel
39 Semiconductor materials and devices characterization by noise measurements
17 2 p. 48
 artikel
40 Some present and future applications of laser processing—an overview
17 2 p. 48-49
 artikel
41 Sophisticated page makeup gets personal
17 2 p. 46
 artikel
42 Step coverage by vapour deposited thin aluminum films
17 2 p. 47
 artikel
43 Structural characterization of processed silicon wafers
17 2 p. 50
 artikel
44 Surface Mounted Semiconductors Howson, M.
17 2 p. 38
 artikel
45 Surface mounted semiconductors: A NEW report forecasting the availability of SM Components and Board Assembly Equipments from the leading edge suppliers
17 2 p. 12
 artikel
46 Surface mount technology experience: Problems and solutions Davis, Mitch
17 2 p. 33-36
 artikel
47 The effect of hydrogen ambients on electromigration kinetics in A1–2% Cu thin film conductors
17 2 p. 48
 artikel
48 The impact of surface mount technology on electronics manufacturing Derman, Glenda
17 2 p. 5-11
 artikel
49 The Korean Semiconductor Industry Morgan, B.
17 2 p. 39
 artikel
50 Thermal design of electronic circuit boards and packages
17 2 p. 32
 artikel
51 Top-edge imaging in E-beam lithography
17 2 p. 48
 artikel
52 X-ray lithography: optical's heir
17 2 p. 48
 artikel
                             52 gevonden resultaten
 
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