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                             59 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A design for a 16 bit processor using only 600 transistors Shute, M.J.
15 3 p. 5-11
 artikel
2 A new technique for the evaluation of the temperatures arising from some geometrics which commonly occur in microelectronics
15 3 p. 44
 artikel
3 An experimental and theoretical study of polycrystalline thin film transistor
15 3 p. 45
 artikel
4 An integrated LSI design aids system
15 3 p. 40
 artikel
5 Anisotropy control in dry etching
15 3 p. 39
 artikel
6 Application of step stress to time dependent breakdown
15 3 p. 42
 artikel
7 Automated in-line puddle development of positive photoresists
15 3 p. 39
 artikel
8 Automating test generation closes the design loop
15 3 p. 44
 artikel
9 Can ATE be trusted by QC?
15 3 p. 45
 artikel
10 Chemiluminscence during photoresist stripping processes
15 3 p. 40
 artikel
11 Comments on “Influence of series and parallel transistors on DC characteristics of CMOS logic circuits” Tomislav, Dzekov
15 3 p. 36-37
 artikel
12 Comparison of new technologies for VLSI: possibilities and limitations
15 3 p. 38
 artikel
13 Condensation thermography – a novel approach for locating short circuits and determining surface temperatures in semiconductor die
15 3 p. 41
 artikel
14 Conductance of small semiconductor devices
15 3 p. 38
 artikel
15 Deep centres introduced by argon ion bombardment in n-type silicon
15 3 p. 39
 artikel
16 Desensitisation of the oscillation frequency of RC sub-audio sinewave generators with single resistor control Saha, A.R.
15 3 p. 18-22
 artikel
17 Dynamic measurement of the water vapour content of integrated circuit packages using derivative infrared diode laser spectroscopy
15 3 p. 45
 artikel
18 Economics of functional testing at selected levels
15 3 p. 44
 artikel
19 Editorial Butcher, John
15 3 p. 3
 artikel
20 Effective logic analysis techniques for increased design productivity Blattner, J.D.
15 3 p. 23-29
 artikel
21 Electric measurement and modelling of the emitter base junction behaviour of VLSI silicon transistor
15 3 p. 43
 artikel
22 Electron microscopy and failure analysis
15 3 p. 40
 artikel
23 Electro-thermomigration in NMOS LSI devices
15 3 p. 45
 artikel
24 Evaluation of critical surface cleanliness by secondary ion mass spectroscopy
15 3 p. 40
 artikel
25 Failure modes in GaAs power FETs: Ohmic contact electromigration and formation of refractory oxides
15 3 p. 43
 artikel
26 Forthcoming events
15 3 p. 46-48
 artikel
27 High density packaging technology
15 3 p. 38
 artikel
28 High speed SOS and GaAs IC testing in the 1980s
15 3 p. 43
 artikel
29 Infrared firing of thick film compositions
15 3 p. 39
 artikel
30 Ion-assisted plasma etching of silicon-oxides in a multifacet system
15 3 p. 40
 artikel
31 Ion implantation in wafer fabrication
15 3 p. 41
 artikel
32 Large scale integration and packaging technologies for telecommunication equipment
15 3 p. 40
 artikel
33 Laser annealing
15 3 p. 38
 artikel
34 Laser-patterned Ta2N resistors for thin film circuits
15 3 p. 41
 artikel
35 Low-value nickel resistors electroless-plated on ‘IMST’ substrate for power hybrid ICs
15 3 p. 39
 artikel
36 Manufacturing high-density memory chips
15 3 p. 41
 artikel
37 Memory retention life at various environmental and life tests
15 3 p. 42
 artikel
38 Microelectronic test chips in integrated circuit manufacturing
15 3 p. 39
 artikel
39 Multilayer resist systems for lithography
15 3 p. 40
 artikel
40 Nondestructive infrared inspection of hybrid microcircuit substrate-to-package thermal adhesive bonds
15 3 p. 44
 artikel
41 Novel design of the output stage for four-phase dynamic VLSI logic Patel, D.C.
15 3 p. 12-17
 artikel
42 On built-in test techniques in reliable computer systems
15 3 p. 44
 artikel
43 Optical requirements for projection lithography
15 3 p. 40
 artikel
44 Optimisation of access points for automatic test program generation and fault location in large analogue circuits and systems
15 3 p. 41
 artikel
45 Processing considerations of thick film devices with multi-layered resistors
15 3 p. 39
 artikel
46 Process modeling of integrated circuit device technology
15 3 p. 41
 artikel
47 Recent trends in ion implantation
15 3 p. 41
 artikel
48 Reliability problems in TTL-LS devices
15 3 p. 44-45
 artikel
49 SEM/EDAX analysis of PIND test failures
15 3 p. 42-43
 artikel
50 Software aids to microcomputer system reliability
15 3 p. 44
 artikel
51 Software maintainability — what it means and how to achieve it
15 3 p. 42
 artikel
52 Temperature accelerated estimation of MNOS memory reliability
15 3 p. 43
 artikel
53 Temperature dependent defect level for an ionic failure mechanism
15 3 p. 38
 artikel
54 Testing and reliability of throughplatings in thin film hybrid circuits
15 3 p. 42
 artikel
55 Testing of properties for soldered leadless chip carrier assemblies
15 3 p. 43
 artikel
56 The density of platinum and palladium powders for thick film pastes Anjard Sr, Roland P.
15 3 p. 30-35
 artikel
57 Thin film metallisation studies and device lifetime prediction using Al-Si and Al-Cu-Si conductor test bars
15 3 p. 41
 artikel
58 Thin film technology used in Bell System telecommunication circuits
15 3 p. 45
 artikel
59 Vacuum operated mercury probe for CV plotting and profiling
15 3 p. 42
 artikel
                             59 gevonden resultaten
 
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