nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
An air-firing base metal resistor and conductor system for low cost thick film circuit manufacture
|
|
|
1984 |
15 |
2 |
p. 75- 1 p. |
artikel |
2 |
An evaluation of plastic coating for high reliability micro-circuits
|
|
|
1984 |
15 |
2 |
p. 75- 1 p. |
artikel |
3 |
Application of electron beams in thermal processing of semiconductor materials and devices
|
McMahon, R.A. |
|
1984 |
15 |
2 |
p. 5-23 19 p. |
artikel |
4 |
A review of thick film microwave integrated circuit technology
|
Newport, Clive |
|
1984 |
15 |
2 |
p. 44-52 9 p. |
artikel |
5 |
Automated parametric testers to monitor the integrated circuit process
|
|
|
1984 |
15 |
2 |
p. 76- 1 p. |
artikel |
6 |
Board testing meets the challenges of ECL
|
|
|
1984 |
15 |
2 |
p. 77- 1 p. |
artikel |
7 |
Characterisation of thick film compositions on RCA porcelain-coated steel substrates
|
|
|
1984 |
15 |
2 |
p. 75- 1 p. |
artikel |
8 |
CMOS schmitt trigger with wide hysteresis
|
Dokić, Branko L. |
|
1984 |
15 |
2 |
p. 24-29 6 p. |
artikel |
9 |
Computer-aided design of VLSI circuits
|
|
|
1984 |
15 |
2 |
p. 76- 1 p. |
artikel |
10 |
DC conduction mechanisms in thin polyimide films
|
|
|
1984 |
15 |
2 |
p. 74- 1 p. |
artikel |
11 |
Dynamics of charge collection from alpha-particle tracks in integrated circuits
|
|
|
1984 |
15 |
2 |
p. 74- 1 p. |
artikel |
12 |
Editorial
|
Butcher, John |
|
1984 |
15 |
2 |
p. 3- 1 p. |
artikel |
13 |
Electrical characterisation of crystal defects and oxygen in Czochralski silicon using a gate-controlled diode
|
|
|
1984 |
15 |
2 |
p. 74-75 2 p. |
artikel |
14 |
Electron-beam projector suits up for submicrometer race
|
|
|
1984 |
15 |
2 |
p. 76- 1 p. |
artikel |
15 |
Electron beam writes next-generation IC patterns
|
|
|
1984 |
15 |
2 |
p. 76- 1 p. |
artikel |
16 |
Electrostatic discharge failures of semiconductor devices
|
|
|
1984 |
15 |
2 |
p. 76- 1 p. |
artikel |
17 |
Etching SiO2 in a reactive ion beam
|
|
|
1984 |
15 |
2 |
p. 77- 1 p. |
artikel |
18 |
Fabrication of nonreciprocal microwave components using thick film ferrimagnetic pastes
|
|
|
1984 |
15 |
2 |
p. 77- 1 p. |
artikel |
19 |
Forthcoming events
|
|
|
1984 |
15 |
2 |
p. 78-80 3 p. |
artikel |
20 |
Future applications of a full capability engineering work station
|
Holland, Les |
|
1984 |
15 |
2 |
p. 30-37 8 p. |
artikel |
21 |
Implanted p-channel MOS transistor threshold voltage dependence on impurity segregation during oxidation
|
|
|
1984 |
15 |
2 |
p. 76-77 2 p. |
artikel |
22 |
Ion implantation gettering; a fundamental approach
|
|
|
1984 |
15 |
2 |
p. 76- 1 p. |
artikel |
23 |
Multi-layer 2 MIL line technology
|
|
|
1984 |
15 |
2 |
p. 77- 1 p. |
artikel |
24 |
[No title]
|
Pitt, Keith |
|
1984 |
15 |
2 |
p. 72-73 2 p. |
artikel |
25 |
[No title]
|
Butcher, J.B. |
|
1984 |
15 |
2 |
p. 71-72 2 p. |
artikel |
26 |
[No title]
|
Butcher, J.B. |
|
1984 |
15 |
2 |
p. 71- 1 p. |
artikel |
27 |
Reliability of DH Ga1−xAlxAs LEDs for lightwave communications
|
|
|
1984 |
15 |
2 |
p. 77- 1 p. |
artikel |
28 |
SEM/EDX analyses of some interactions between thick film resistors and dielectrics
|
Adie, George |
|
1984 |
15 |
2 |
p. 38-43 6 p. |
artikel |
29 |
Silver migration in thick film conductors and chip attachment resins
|
|
|
1984 |
15 |
2 |
p. 74- 1 p. |
artikel |
30 |
Solder pastes for microelectronics
|
Anjard Sr., Ronald P. |
|
1984 |
15 |
2 |
p. 53-64 12 p. |
artikel |
31 |
Technology of electronic grade solder pastes
|
|
|
1984 |
15 |
2 |
p. 75-76 2 p. |
artikel |
32 |
Test strategy enhances, speeds the development of a microprocessor
|
|
|
1984 |
15 |
2 |
p. 77- 1 p. |
artikel |
33 |
The effect of oxygen and argon on the interdiffusion of Au−Al thin film couples
|
|
|
1984 |
15 |
2 |
p. 75- 1 p. |
artikel |
34 |
Thick film capacitor materials of the powder-glass binary systems and their dielectric properties
|
|
|
1984 |
15 |
2 |
p. 74- 1 p. |
artikel |
35 |
Trends in packaging and their impact on circuit board designs
|
Messner, George |
|
1984 |
15 |
2 |
p. 65-70 6 p. |
artikel |
36 |
Typical applications of ion implanted layer as a diffusion source for MOS and bipolar devices
|
|
|
1984 |
15 |
2 |
p. 77- 1 p. |
artikel |
37 |
X-ray lithography exposure machines
|
|
|
1984 |
15 |
2 |
p. 77- 1 p. |
artikel |