| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
An air-firing base metal resistor and conductor system for low cost thick film circuit manufacture
|
|
|
|
15 |
2 |
p. 75
|
artikel
|
| 2 |
An evaluation of plastic coating for high reliability micro-circuits
|
|
|
|
15 |
2 |
p. 75
|
artikel
|
| 3 |
Application of electron beams in thermal processing of semiconductor materials and devices
|
McMahon, R.A.
|
|
|
15 |
2 |
p. 5-23
|
artikel
|
| 4 |
A review of thick film microwave integrated circuit technology
|
Newport, Clive
|
|
|
15 |
2 |
p. 44-52
|
artikel
|
| 5 |
Automated parametric testers to monitor the integrated circuit process
|
|
|
|
15 |
2 |
p. 76
|
artikel
|
| 6 |
Board testing meets the challenges of ECL
|
|
|
|
15 |
2 |
p. 77
|
artikel
|
| 7 |
Characterisation of thick film compositions on RCA porcelain-coated steel substrates
|
|
|
|
15 |
2 |
p. 75
|
artikel
|
| 8 |
CMOS schmitt trigger with wide hysteresis
|
Dokić, Branko L.
|
|
|
15 |
2 |
p. 24-29
|
artikel
|
| 9 |
Computer-aided design of VLSI circuits
|
|
|
|
15 |
2 |
p. 76
|
artikel
|
| 10 |
DC conduction mechanisms in thin polyimide films
|
|
|
|
15 |
2 |
p. 74
|
artikel
|
| 11 |
Dynamics of charge collection from alpha-particle tracks in integrated circuits
|
|
|
|
15 |
2 |
p. 74
|
artikel
|
| 12 |
Editorial
|
Butcher, John
|
|
|
15 |
2 |
p. 3
|
artikel
|
| 13 |
Electrical characterisation of crystal defects and oxygen in Czochralski silicon using a gate-controlled diode
|
|
|
|
15 |
2 |
p. 74-75
|
artikel
|
| 14 |
Electron-beam projector suits up for submicrometer race
|
|
|
|
15 |
2 |
p. 76
|
artikel
|
| 15 |
Electron beam writes next-generation IC patterns
|
|
|
|
15 |
2 |
p. 76
|
artikel
|
| 16 |
Electrostatic discharge failures of semiconductor devices
|
|
|
|
15 |
2 |
p. 76
|
artikel
|
| 17 |
Etching SiO2 in a reactive ion beam
|
|
|
|
15 |
2 |
p. 77
|
artikel
|
| 18 |
Fabrication of nonreciprocal microwave components using thick film ferrimagnetic pastes
|
|
|
|
15 |
2 |
p. 77
|
artikel
|
| 19 |
Forthcoming events
|
|
|
|
15 |
2 |
p. 78-80
|
artikel
|
| 20 |
Future applications of a full capability engineering work station
|
Holland, Les
|
|
|
15 |
2 |
p. 30-37
|
artikel
|
| 21 |
Implanted p-channel MOS transistor threshold voltage dependence on impurity segregation during oxidation
|
|
|
|
15 |
2 |
p. 76-77
|
artikel
|
| 22 |
Ion implantation gettering; a fundamental approach
|
|
|
|
15 |
2 |
p. 76
|
artikel
|
| 23 |
Multi-layer 2 MIL line technology
|
|
|
|
15 |
2 |
p. 77
|
artikel
|
| 24 |
[No title]
|
Pitt, Keith
|
|
|
15 |
2 |
p. 72-73
|
artikel
|
| 25 |
[No title]
|
Butcher, J.B.
|
|
|
15 |
2 |
p. 71
|
artikel
|
| 26 |
[No title]
|
Butcher, J.B.
|
|
|
15 |
2 |
p. 71-72
|
artikel
|
| 27 |
Reliability of DH Ga1−xAlxAs LEDs for lightwave communications
|
|
|
|
15 |
2 |
p. 77
|
artikel
|
| 28 |
SEM/EDX analyses of some interactions between thick film resistors and dielectrics
|
Adie, George
|
|
|
15 |
2 |
p. 38-43
|
artikel
|
| 29 |
Silver migration in thick film conductors and chip attachment resins
|
|
|
|
15 |
2 |
p. 74
|
artikel
|
| 30 |
Solder pastes for microelectronics
|
Anjard Sr., Ronald P.
|
|
|
15 |
2 |
p. 53-64
|
artikel
|
| 31 |
Technology of electronic grade solder pastes
|
|
|
|
15 |
2 |
p. 75-76
|
artikel
|
| 32 |
Test strategy enhances, speeds the development of a microprocessor
|
|
|
|
15 |
2 |
p. 77
|
artikel
|
| 33 |
The effect of oxygen and argon on the interdiffusion of Au−Al thin film couples
|
|
|
|
15 |
2 |
p. 75
|
artikel
|
| 34 |
Thick film capacitor materials of the powder-glass binary systems and their dielectric properties
|
|
|
|
15 |
2 |
p. 74
|
artikel
|
| 35 |
Trends in packaging and their impact on circuit board designs
|
Messner, George
|
|
|
15 |
2 |
p. 65-70
|
artikel
|
| 36 |
Typical applications of ion implanted layer as a diffusion source for MOS and bipolar devices
|
|
|
|
15 |
2 |
p. 77
|
artikel
|
| 37 |
X-ray lithography exposure machines
|
|
|
|
15 |
2 |
p. 77
|
artikel
|
Tijdschrift beschrijving