| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accelerated testing of time related parameters in MNOS memories
|
|
|
|
15 |
1 |
p. 63
|
artikel
|
| 2 |
Aluminium plasma etch considerations for VLSI production
|
|
|
|
15 |
1 |
p. 63
|
artikel
|
| 3 |
Bondability problems associated with the Ti-Pt-Au metallisation of hybrid microwave thin film circuits
|
|
|
|
15 |
1 |
p. 62
|
artikel
|
| 4 |
Carrier mobilities in silicon semi-empirically related to temperature, doping and injection level
|
|
|
|
15 |
1 |
p. 62
|
artikel
|
| 5 |
Cermet resistors on ceramic substrates
|
|
|
|
15 |
1 |
p. 61
|
artikel
|
| 6 |
Chip carriers mounted on large thick film multilayer boards
|
|
|
|
15 |
1 |
p. 61
|
artikel
|
| 7 |
Computer-assisted development of hybrid integrated hyperfrequency circuits
|
|
|
|
15 |
1 |
p. 62
|
artikel
|
| 8 |
Drift in switched-capacitor integrators
|
MacQuigg, D.
|
|
|
15 |
1 |
p. 38-49
|
artikel
|
| 9 |
Editorial
|
Butcher, John
|
|
|
15 |
1 |
p. 3
|
artikel
|
| 10 |
Editorial Board
|
|
|
|
15 |
1 |
p. ii
|
artikel
|
| 11 |
Experimental and mathematical determination of mechanical strains within plastic IC packages and their effect on devices during environmental tests
|
|
|
|
15 |
1 |
p. 63
|
artikel
|
| 12 |
Experimental studies of distributed lumped phase shift networks
|
Ahmad, S.
|
|
|
15 |
1 |
p. 54-59
|
artikel
|
| 13 |
Failure analysis in semiconductor devices – rationale, methodology and practice
|
Richards, B.P.
|
|
|
15 |
1 |
p. 5-25
|
artikel
|
| 14 |
GaAs mesa diodes made by direct-writing laser stimulated MOCVD
|
Roth, W.
|
|
|
15 |
1 |
p. 26-29
|
artikel
|
| 15 |
Ion beam lithography
|
|
|
|
15 |
1 |
p. 63
|
artikel
|
| 16 |
Low energy LSI and packaging for system performance
|
|
|
|
15 |
1 |
p. 61
|
artikel
|
| 17 |
On selective electroplating of gold in fabrication of MICs
|
|
|
|
15 |
1 |
p. 63
|
artikel
|
| 18 |
Parasitic MOSFETs in an oxide-isolated bipolar technology: Process-control measurements
|
Stevens, E.H.
|
|
|
15 |
1 |
p. 50-53
|
artikel
|
| 19 |
Phase dependent voltage contrast — An inexpensive SEM addition for LSI failure analysis
|
|
|
|
15 |
1 |
p. 63
|
artikel
|
| 20 |
Punch-through currents in P+NP+ and N+PN+ sandwich structures — II General low-injection theory and measurements
|
|
|
|
15 |
1 |
p. 62
|
artikel
|
| 21 |
Punch-through currents in P+NP+ and N+PN+ sandwich structures — I Introduction and basic calculations
|
|
|
|
15 |
1 |
p. 62
|
artikel
|
| 22 |
Reliability of PtSi-Ti/W-Al metallisation system used in bipolar logics
|
|
|
|
15 |
1 |
p. 63
|
artikel
|
| 23 |
Terminal and cooling requirements for LSI packages
|
|
|
|
15 |
1 |
p. 62
|
artikel
|
| 24 |
The effects of moisture on multilayered ceramic top brazed flat packs
|
|
|
|
15 |
1 |
p. 63
|
artikel
|
| 25 |
The influence of air-abrasive trimming on the current noise of thick film resistors
|
|
|
|
15 |
1 |
p. 63
|
artikel
|
| 26 |
Time-resolved scanned electron beam annealing of ion-implanted polycrystalline silicon
|
Krimmel, E.F.
|
|
|
15 |
1 |
p. 30-37
|
artikel
|
| 27 |
VLSI Electronics Volumes 1–6
|
Krejcik, M.
|
|
|
15 |
1 |
p. 60
|
artikel
|
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