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                             37 results found
no title author magazine year volume issue page(s) type
1 A data-base for IC mask making Kundu, N.N.

14 5 p. 43-52
article
2 Advances in low cost silver-containing thick film conductors
14 5 p. 81-82
article
3 Arsenic spin-on source for deep junction formation
14 5 p. 84
article
4 A study of masking properties of SiO2 and photoresists with boron ion implantation
14 5 p. 84
article
5 Automatic production system for circuit boards with universal hybrid integrated circuits
14 5 p. 82
article
6 CMOS regenerative logic circuits Dokić, Branko L.

14 5 p. 21-30
article
7 Consequences of contact resistance in very-small-geometry CML gates Stevens, E.H.

14 5 p. 15-20
article
8 Design and evaluation of RC active filters for hybrid thick film implementation
14 5 p. 80
article
9 Development and evaluation of a pre-encapsulating cleaning process to improve realiability of HICs with aluminium metallised chips
14 5 p. 83
article
10 Editorial Butcher, John

14 5 p. 3
article
11 Electrical characteristics of polymer thick film resistors, Part I: experimental results
14 5 p. 83
article
12 Electronic structure of SiO2 (111) thin film
14 5 p. 84
article
13 Erlevel insulation reliability evaluation
14 5 p. 81
article
14 Gallium: Arsenide and related compounds 1982
14 5 p. 77-78
article
15 High slew rate CMOS operational amplifier employing internal transistor compensation Wu, Bingxin

14 5 p. 5-13
article
16 How a computer is developed and produced Heusler, Joachim

14 5 p. 53-75
article
17 Ider attachment of leaded components to ck film hybrids
14 5 p. 81
article
18 Improved cost effectiveness and product reliability through solder alloy development
14 5 p. 83
article
19 Integrated optics: a tutorial review
14 5 p. 84
article
20 interactive design system for hybrid ICs
14 5 p. 81
article
21 Internal gettering in silicon
14 5 p. 84
article
22 Model of impurity diffusion from an oxide source into silicon
14 5 p. 84
article
23 Nichrome thin film technology and its application
14 5 p. 83
article
24 Novel switched capacitor realisations of floating FDNC Kumar, Umesh

14 5 p. 31-34
article
25 Optoelectronics: An introduction
14 5 p. 77
article
26 Packaging trade-offs for an LSI-oriented very high-speed computer, the HITAC M-200H
14 5 p. 80
article
27 Reference materials and the semiconductor industry
14 5 p. 84
article
28 Reliability evaluation of aluminium-metallised MOS dynamic RAM's in plastic packages in high humidity and temperature environments
14 5 p. 82
article
29 Residual stress in thick films Kirby, P.L.

14 5 p. 35-41
article
30 Resistors screen printed on ceramic-coated steel substrates
14 5 p. 82
article
31 Solder post attachment of ceramic chip carriers to ceramic film integrated circuits
14 5 p. 81
article
32 Speech enhancement
14 5 p. 78-79
article
33 The effect of high speed laser trimming on accuracy and stability of thick film resistors
14 5 p. 80
article
34 The influence of boron induced and oxidation induced defects on bipolar transistor slice yield
14 5 p. 83
article
35 The influence of the area of a thin film capacitor on the breakdown voltage
14 5 p. 80
article
36 VLSI circuit development for future applications
14 5 p. 84
article
37 X-ray and microscopic investigations of resistors containing CdO and RuO2
14 5 p. 83
article
                             37 results found
 
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