| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Advances in CCD scanners with on-chip signal processing for electronic imaging
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12 |
5 |
p. 43
|
artikel
|
| 2 |
Advances in GaAs LSI/VLSI processing technology
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12 |
5 |
p. 41
|
artikel
|
| 3 |
Advances in wafer process control
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12 |
5 |
p. 40
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artikel
|
| 4 |
A GaAs MESFET sample and hold switch
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12 |
5 |
p. 39
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artikel
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| 5 |
A high-speed multiplier using subnanosecond bipolar VLSI technologies
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12 |
5 |
p. 38
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artikel
|
| 6 |
Aluminium-silicon OHMIC contact on ‘shallow’ n+/p junctions
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12 |
5 |
p. 40
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artikel
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| 7 |
A new air film technique for low contact handling of silicon wafers
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12 |
5 |
p. 41
|
artikel
|
| 8 |
A new ultra low power ULA and its application
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12 |
5 |
p. 38
|
artikel
|
| 9 |
An integrated circuit VHF radio receiver
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12 |
5 |
p. 44
|
artikel
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| 10 |
An investigation of the interface state density in metal-silicon nitride-silicon structures
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12 |
5 |
p. 43
|
artikel
|
| 11 |
A 500-picosecond system design capability
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12 |
5 |
p. 39
|
artikel
|
| 12 |
A survey of corrosion failure mechanisms in microelectronic devices
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12 |
5 |
p. 39
|
artikel
|
| 13 |
Avalanche injection in MNOS gate controlled diodes
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12 |
5 |
p. 43
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artikel
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| 14 |
16-bit microprocessor enters virtual memory domain
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12 |
5 |
p. 44
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artikel
|
| 15 |
Book Review
|
Woodcock, K.W.
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12 |
5 |
p. 37
|
artikel
|
| 16 |
Book Review
|
Matthews, R.B.
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12 |
5 |
p. 37
|
artikel
|
| 17 |
Book Review
|
Bloyce, M.R.E.
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12 |
5 |
p. 37
|
artikel
|
| 18 |
Built-in test for complex digital integrated circuits
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12 |
5 |
p. 43
|
artikel
|
| 19 |
Charge injection from a surface depletion region the Al2O3-silicon system
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12 |
5 |
p. 41
|
artikel
|
| 20 |
Chip carrier packaging applications
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12 |
5 |
p. 40
|
artikel
|
| 21 |
Computer aided design of LSI: and I2L case study
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12 |
5 |
p. 40
|
artikel
|
| 22 |
Computer-aided determination of tests for the detection and localisation of faults in electronic circuits and systems
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12 |
5 |
p. 42
|
artikel
|
| 23 |
Cost effective semiconductor memory testing
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12 |
5 |
p. 43
|
artikel
|
| 24 |
Current aspects of CAD for integrated circuits
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12 |
5 |
p. 40
|
artikel
|
| 25 |
Custom ECL chips boost performance in smaller mainframes
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12 |
5 |
p. 44
|
artikel
|
| 26 |
Decoding scheme smooths 18-bit converter's nonlinearity
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12 |
5 |
p. 44
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artikel
|
| 27 |
Digital system diagnostics-design/evaluation
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12 |
5 |
p. 42-43
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artikel
|
| 28 |
Distributed computer network takes charge in IC facility
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12 |
5 |
p. 43
|
artikel
|
| 29 |
Electrothermal effects in integrated circuits
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12 |
5 |
p. 44
|
artikel
|
| 30 |
Experimental investigation of mounting thermal resistance of flatpacks on circuit boards
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12 |
5 |
p. 43
|
artikel
|
| 31 |
Extension of high-temperature electronics
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12 |
5 |
p. 39
|
artikel
|
| 32 |
Failure analysis on a 65K MOS RAM with a new type of memory display
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12 |
5 |
p. 42
|
artikel
|
| 33 |
Fully automated integrated circuit wire bonding system
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12 |
5 |
p. 41
|
artikel
|
| 34 |
Guest editorial
|
Walker, P.A.
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|
12 |
5 |
p. 3
|
artikel
|
| 35 |
Hardening RAMs against soft errors
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12 |
5 |
p. 42
|
artikel
|
| 36 |
High frequency magnetic bubble devices
|
Breed, D.J.
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12 |
5 |
p. 15-18
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artikel
|
| 37 |
Implementation constraints in self-checking integrated circuits
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12 |
5 |
p. 42
|
artikel
|
| 38 |
Intelligent memories and the silicon chip
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12 |
5 |
p. 44
|
artikel
|
| 39 |
Interdiffusion processes and oxidation phenomena in NiCr/Au films
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12 |
5 |
p. 39
|
artikel
|
| 40 |
Ion beams promise practical systems for submicrometer wafer lithography
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12 |
5 |
p. 44
|
artikel
|
| 41 |
Large-scale integration latches onto the phone system
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12 |
5 |
p. 44
|
artikel
|
| 42 |
Loading effect and temperature dependence of etch rate of silicon materials in CF4 plasma
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12 |
5 |
p. 41
|
artikel
|
| 43 |
Magnetic bubble propagation for the dual conductor current-access test circuit
|
Kawasaki, T.
|
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12 |
5 |
p. 19-22
|
artikel
|
| 44 |
Microcrack detection in silicon crystals with an ultrasonic sonoprobe
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12 |
5 |
p. 43
|
artikel
|
| 45 |
Microelectronics—the revolution in consumer equipment
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12 |
5 |
p. 44
|
artikel
|
| 46 |
Minicomputer fills mainframe's shows
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12 |
5 |
p. 44
|
artikel
|
| 47 |
Multiple-drain MOS packs in very fast logic gates
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12 |
5 |
p. 44
|
artikel
|
| 48 |
Observation of valley splitting in (111)n-type silicon inversion layers
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|
12 |
5 |
p. 39
|
artikel
|
| 49 |
Optical end-point detection for the plasma etching of aluminium
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|
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12 |
5 |
p. 41
|
artikel
|
| 50 |
Performance of the porcelain-metal substrate at microwaves
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12 |
5 |
p. 39
|
artikel
|
| 51 |
Plasma deposited polycrystalline silicon films
|
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|
12 |
5 |
p. 41
|
artikel
|
| 52 |
Plasma etching for SiO2 profile control
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12 |
5 |
p. 41
|
artikel
|
| 53 |
Polysilicon self-aligned technology — a new approach for bipolar LSIs
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12 |
5 |
p. 41
|
artikel
|
| 54 |
Preoxidation gettering of oxidation-induced stacking faults in silicon by the phosphorus diffusion process
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12 |
5 |
p. 42
|
artikel
|
| 55 |
Preparation and some magnetic properties of amorphous rare earth-transition metal films with perpendicular anisotropy for bubble memory
|
Katayama, T.
|
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|
12 |
5 |
p. 23-29
|
artikel
|
| 56 |
Properties of plasma enhanced CVD silicon nitride: measurements and interpretations
|
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12 |
5 |
p. 43-44
|
artikel
|
| 57 |
Quantitative comparison of electronic component/solder joint stress relief in encapsulated assemblies
|
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12 |
5 |
p. 41
|
artikel
|
| 58 |
Reliable Multiwire circuits with small gauge wires
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12 |
5 |
p. 39
|
artikel
|
| 59 |
Review of ion-implanted bubble devices
|
Bonyhard, P.I.
|
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|
12 |
5 |
p. 5-7
|
artikel
|
| 60 |
Semi-empirical APW calculation of the band structure of silicon
|
|
|
|
12 |
5 |
p. 39
|
artikel
|
| 61 |
Soft errors in VLSI: present and future
|
|
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|
12 |
5 |
p. 44
|
artikel
|
| 62 |
Some considerations for peripheral circuits for bubble memory
|
Okada, M.
|
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|
12 |
5 |
p. 30-36
|
artikel
|
| 63 |
Some facts about environmental stress screening
|
|
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|
12 |
5 |
p. 42
|
artikel
|
| 64 |
Some fundamental properties of aluminium-aluminium electrical contacts
|
|
|
|
12 |
5 |
p. 40
|
artikel
|
| 65 |
Technical and practical considerations of incorporating microprocessors in OEM products—a management view
|
|
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|
12 |
5 |
p. 44
|
artikel
|
| 66 |
The BCML circuit and packing system
|
|
|
|
12 |
5 |
p. 40
|
artikel
|
| 67 |
The contiguous disk technology for high density bubble memories
|
Jouve, H.
|
|
|
12 |
5 |
p. 8-14
|
artikel
|
| 68 |
The effects of phosphorus diffusion cooling rate on I2L gain
|
|
|
|
12 |
5 |
p. 42
|
artikel
|
| 69 |
The MOM 400 single-chip microcomputer
|
|
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12 |
5 |
p. 44
|
artikel
|
| 70 |
The performance of plastic-encapsulated CMOS microcircuits in a humid environment
|
|
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|
12 |
5 |
p. 43
|
artikel
|
| 71 |
The promotion of VLSI and microlithography in Germany
|
|
|
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12 |
5 |
p. 40
|
artikel
|
| 72 |
The steady-state distribution of signal charge in charge-coupled devices
|
|
|
|
12 |
5 |
p. 43
|
artikel
|
| 73 |
The use of an industrial x-ray source for electronic component radiation effects work
|
|
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|
12 |
5 |
p. 42
|
artikel
|
| 74 |
Two-chip radio link pilots toys and models
|
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12 |
5 |
p. 44
|
artikel
|
| 75 |
Ultrasonic in-line inspection technique for contact materials
|
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12 |
5 |
p. 42
|
artikel
|
| 76 |
Universal logic gates for custom-design IC requirements
|
|
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|
12 |
5 |
p. 38-39
|
artikel
|
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