| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A review of CCD imaging technology
|
|
|
|
10 |
2 |
p. 41
|
artikel
|
| 2 |
A study and implementation of a semiconductor memory board
|
|
|
|
10 |
2 |
p. 41
|
artikel
|
| 3 |
Book Review
|
Hammersley, Peter
|
|
|
10 |
2 |
p. 43
|
artikel
|
| 4 |
Book Review
|
Baker, P.D.W.
|
|
|
10 |
2 |
p. 43-44
|
artikel
|
| 5 |
Book Review
|
Matthews, R.B.
|
|
|
10 |
2 |
p. 44
|
artikel
|
| 6 |
Book Review
|
Bull, Don
|
|
|
10 |
2 |
p. 43
|
artikel
|
| 7 |
CCD with meander channel
|
|
|
|
10 |
2 |
p. 41
|
artikel
|
| 8 |
Charging pumping effect and its application in the MOS transistors investigations
|
|
|
|
10 |
2 |
p. 40
|
artikel
|
| 9 |
Computer aided design
|
Jennings, Richard M.
|
|
|
10 |
2 |
p. 35-36
|
artikel
|
| 10 |
Custom designed LSI for instrumentation
|
Taylor, Gordon
|
|
|
10 |
2 |
p. 37-39
|
artikel
|
| 11 |
Demands of LSI are turning chip makers towards automation, production innovations
|
|
|
|
10 |
2 |
p. 42
|
artikel
|
| 12 |
Depletion-capacitance-induced distortion in surface-channel CCD transversal filters
|
|
|
|
10 |
2 |
p. 41
|
artikel
|
| 13 |
Direct wafer exposure
|
Resor, Griffith L.
|
|
|
10 |
2 |
p. 18-29
|
artikel
|
| 14 |
Drain characteristics of thin film MOS FETs
|
|
|
|
10 |
2 |
p. 40
|
artikel
|
| 15 |
Editorial
|
Butcher, John
|
|
|
10 |
2 |
p. 3
|
artikel
|
| 16 |
Electrical conduction by percolation in thick film resistors
|
|
|
|
10 |
2 |
p. 42
|
artikel
|
| 17 |
I2L: A comprehensive review of techniques and technology
|
|
|
|
10 |
2 |
p. 40
|
artikel
|
| 18 |
Integrated injection logic (I2L)
|
|
|
|
10 |
2 |
p. 40-41
|
artikel
|
| 19 |
Investigation of the Au-Ge-Ni system used for alloyed contacts to GaAs
|
|
|
|
10 |
2 |
p. 42
|
artikel
|
| 20 |
Invited: growth and doping kinetics in molecular beam epitaxy
|
|
|
|
10 |
2 |
p. 42
|
artikel
|
| 21 |
Large scale integration
|
|
|
|
10 |
2 |
p. 41
|
artikel
|
| 22 |
Metallurgical aspects of aluminium wire bonds to gold metallisation
|
|
|
|
10 |
2 |
p. 41
|
artikel
|
| 23 |
Microfiltration of high purity deionised water
|
Carbonel, B.
|
|
|
10 |
2 |
p. 13-17
|
artikel
|
| 24 |
Plasma reactor design for the selective etching of SiO2 on Si
|
|
|
|
10 |
2 |
p. 42
|
artikel
|
| 25 |
Properties of inlay clad wrought gold alloys
|
|
|
|
10 |
2 |
p. 42
|
artikel
|
| 26 |
Residual lattice absorption in gallium arsenide
|
|
|
|
10 |
2 |
p. 42
|
artikel
|
| 27 |
Resistance increases in gold aluminium interconnects with time and temperature
|
|
|
|
10 |
2 |
p. 42
|
artikel
|
| 28 |
Semiconductor materials for future display devices
|
|
|
|
10 |
2 |
p. 42
|
artikel
|
| 29 |
Silicon epitaxy
|
Hammond, Martin L.
|
|
|
10 |
2 |
p. 4-12
|
artikel
|
| 30 |
64 stage BCD (bulk charge-transfer device) analog memory with differential integrated clock pulse generator
|
|
|
|
10 |
2 |
p. 41
|
artikel
|
| 31 |
Standardisation
|
Moore Sr, George E.
|
|
|
10 |
2 |
p. 30-34
|
artikel
|
| 32 |
The multifacets of I2L
|
|
|
|
10 |
2 |
p. 40
|
artikel
|
| 33 |
The nature of negative photoresist scumming. Part II. NO2 and ozone induced scumming
|
|
|
|
10 |
2 |
p. 42
|
artikel
|
| 34 |
Thermal effects on the photoresist AZ1350J
|
|
|
|
10 |
2 |
p. 41
|
artikel
|
| 35 |
Thermocompression bonding of copper leads plated with thin gold
|
|
|
|
10 |
2 |
p. 41
|
artikel
|
| 36 |
The thermal design of an LSI single-chip package
|
|
|
|
10 |
2 |
p. 41
|
artikel
|
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