nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
Adhesives in the packaging of planar lightwave circuits
|
Xiao, Gao Zhi |
|
2004 |
24 |
4 |
p. 313-318 6 p. |
artikel |
2 |
Analysis of weld-bonded dissimilar materials
|
Darwish, S.M. |
|
2004 |
24 |
4 |
p. 347-354 8 p. |
artikel |
3 |
Bonding strength of some adhesives in wood materials impregnated with Imersol-Aqua
|
Örs, Yalçin |
|
2004 |
24 |
4 |
p. 287-294 8 p. |
artikel |
4 |
Experimental study of static and fatigue strengths of pultruded GFRP rods bonded into LVL and glulam
|
Madhoushi, Mehrab |
|
2004 |
24 |
4 |
p. 319-325 7 p. |
artikel |
5 |
Modelling and experimental investigation of microwave heating of adhesively bonded polypropylene joint
|
So, Hing Wa |
|
2004 |
24 |
4 |
p. 307-312 6 p. |
artikel |
6 |
Novel wood adhesives from condensed tannins and polyethylenimine
|
Li, K. |
|
2004 |
24 |
4 |
p. 327-333 7 p. |
artikel |
7 |
Numerical modelling of lap joints bonded with a rate-dependent adhesive
|
Zgoul, M. |
|
2004 |
24 |
4 |
p. 355-366 12 p. |
artikel |
8 |
Prediction of deformation and failure of rubber-toughened adhesive joints
|
Dean, G. |
|
2004 |
24 |
4 |
p. 295-306 12 p. |
artikel |
9 |
The effect of molecular weight and temperature on tack properties of model polyisobutylenes
|
O’Connor, Adrienne E. |
|
2004 |
24 |
4 |
p. 335-346 12 p. |
artikel |
10 |
The interphase in phenol–formaldehyde and polymeric methylene di-phenyl-di-isocyanate glue lines in wood
|
Gindl, Wolfgang |
|
2004 |
24 |
4 |
p. 279-286 8 p. |
artikel |