| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Adhesion properties of lactic acid based hot melt adhesives and their storage stability in different packaging applications
|
Viljanmaa, M
|
|
2002
|
22 |
6 |
p. 447-457
11 p.
|
artikel
|
| 2 |
Author index
|
|
|
2002
|
22 |
6 |
p. 495-496
2 p.
|
artikel
|
| 3 |
Covalent bonding of wood through chemical activation
|
Mallon, Stephen
|
|
2002
|
22 |
6 |
p. 465-469
5 p.
|
artikel
|
| 4 |
Formation of epoxy-diamine/metal interphases
|
Roche, A.A
|
|
2002
|
22 |
6 |
p. 431-441
11 p.
|
artikel
|
| 5 |
Keyword index
|
|
|
2002
|
22 |
6 |
p. 497-498
2 p.
|
artikel
|
| 6 |
Kinetics of adherence of a rigid truncated cone on an elastic half-space (unfilled natural rubber)
|
Bouissou, S
|
|
2002
|
22 |
6 |
p. 459-463
5 p.
|
artikel
|
| 7 |
Molecular adhesion and its applications: the sticky universe
|
Comyn, John
|
|
2002
|
22 |
6 |
p. 487-
1 p.
|
artikel
|
| 8 |
Sealants in the automotive industry
|
Lavery, M
|
|
2002
|
22 |
6 |
p. 443-445
3 p.
|
artikel
|
| 9 |
Swiss Bonding 2002, 27–29 May 2002
|
Allen, K.W
|
|
2002
|
22 |
6 |
p. 489-490
2 p.
|
artikel
|
| 10 |
The effect of flexible substrates on pressure-sensitive adhesive performance
|
Steven-Fountain, A.J
|
|
2002
|
22 |
6 |
p. 423-430
8 p.
|
artikel
|
| 11 |
Thermal graft copolymerization of 4-vinyl pyridine on polyimide to improve adhesion to copper
|
Chan-Park, M.B
|
|
2002
|
22 |
6 |
p. 471-475
5 p.
|
artikel
|
| 12 |
Use of organosolv lignin in phenol–formaldehyde resins for particleboard production
|
Çetin, Nihat S
|
|
2002
|
22 |
6 |
p. 477-480
4 p.
|
artikel
|
| 13 |
Use of organosolv lignin in phenol-formaldehyde resins for particleboard production
|
Çetin, Nihat S
|
|
2002
|
22 |
6 |
p. 481-486
6 p.
|
artikel
|
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