| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Adhesives produced by reaction of hexachlorocyclotriphosphazene with phenols, bisphenols and benzilic acid
|
Kumar, Devendra
|
|
1998
|
18 |
2 |
p. 109-113
5 p.
|
artikel
|
| 2 |
Dynamic thermomechanical analysis as a control technique for thermoset bonding of wood joints
|
Onic, L.
|
|
1998
|
18 |
2 |
p. 89-94
6 p.
|
artikel
|
| 3 |
Foreword
|
Pizzi, A.
|
|
1998
|
18 |
2 |
p. 67-
1 p.
|
artikel
|
| 4 |
Mechanical properties of adhesive thin films
|
Lučić, S.
|
|
1998
|
18 |
2 |
p. 115-123
9 p.
|
artikel
|
| 5 |
Network characterization of phenol–formaldehyde thermosetting wood adhesive
|
Schmidt, Robert G.
|
|
1998
|
18 |
2 |
p. 139-146
8 p.
|
artikel
|
| 6 |
Observations of peeling of a polyisobutylene-based pressure-sensitive adhesive
|
Christensen, Søren Flygenring
|
|
1998
|
18 |
2 |
p. 131-137
7 p.
|
artikel
|
| 7 |
On the occurrence of network interpenetration in the wood-isocyanate adhesive interphase
|
Frazier, Charles E.
|
|
1998
|
18 |
2 |
p. 81-87
7 p.
|
artikel
|
| 8 |
Phenol–urea–formaldehyde (PUF) co-condensed wood adhesives
|
Tomita, Bunichiro
|
|
1998
|
18 |
2 |
p. 69-79
11 p.
|
artikel
|
| 9 |
Physical modifications for improved peel strength in a high-temperature epoxy adhesive
|
Dixon, D.G.
|
|
1998
|
18 |
2 |
p. 125-130
6 p.
|
artikel
|
| 10 |
Urea–formaldehyde (UF) adhesive resins for wood
|
Dunky, M.
|
|
1998
|
18 |
2 |
p. 95-107
13 p.
|
artikel
|
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