nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
1 |
A consideration of the effect of reactor parameters on the characteristics of layers prepared by low pressure chemical vapour deposition
|
Hitchman, M.L. |
|
1984 |
34 |
3-4 |
p. 377-384 8 p. |
artikel |
2 |
Applications of coatings produced by field emission deposition
|
Prewett, P.D. |
|
1984 |
34 |
3-4 |
p. 385-390 6 p. |
artikel |
3 |
A review of reactive ion beam etching for production
|
Revell, P.J. |
|
1984 |
34 |
3-4 |
p. 455-462 8 p. |
artikel |
4 |
A review of the analysis of surfaces and thin films by AES and XPS
|
Seah, M.P. |
|
1984 |
34 |
3-4 |
p. 463-478 16 p. |
artikel |
5 |
Argon and reactive ion beam etching for SAW devices
|
Chapman, R.E. |
|
1984 |
34 |
3-4 |
p. 417-424 8 p. |
artikel |
6 |
Capabilities of molecular beam epitaxy and materials prospects
|
Bardsley, W. |
|
1984 |
34 |
3-4 |
p. 391-394 4 p. |
artikel |
7 |
Electron probe X-ray microanalysis of surfaces and thin films
|
Bulpett, R. |
|
1984 |
34 |
3-4 |
p. 481-486 6 p. |
artikel |
8 |
Glow discharge characteristics of importance in low pressure plasma techniques
|
|
|
1984 |
34 |
3-4 |
p. 487- 1 p. |
artikel |
9 |
Introduction
|
Williams, B.D. |
|
1984 |
34 |
3-4 |
p. 341- 1 p. |
artikel |
10 |
Investigation of the dependence of reactive ion etching of AlSiCu alloys upon film deposition characteristics
|
Maleham, J. |
|
1984 |
34 |
3-4 |
p. 437-444 8 p. |
artikel |
11 |
Ion implantation and optical devices
|
Townsend, P.D. |
|
1984 |
34 |
3-4 |
p. 395-398 4 p. |
artikel |
12 |
Low pressure chemical vapour (BPOVD) of Al and AlSi alloy films
|
|
|
1984 |
34 |
3-4 |
p. 488- 1 p. |
artikel |
13 |
Low pressure chemical vapour (BPOVD) of Al and AlSi alloy films
|
|
|
1984 |
34 |
3-4 |
p. 488- 1 p. |
artikel |
14 |
Low pressure processes
|
|
|
1984 |
34 |
3-4 |
p. 487- 1 p. |
artikel |
15 |
Magnetron sputtered lithium niobate films
|
Meek, P.R. |
|
1984 |
34 |
3-4 |
p. 411-415 5 p. |
artikel |
16 |
Metal doped polymer films prepared by plasma polymerization and their potential applications
|
Biederman, H. |
|
1984 |
34 |
3-4 |
p. 405-410 6 p. |
artikel |
17 |
New patents
|
|
|
1984 |
34 |
3-4 |
p. 491-494 4 p. |
artikel |
18 |
New sputtering techniques for semiconductor metallization
|
Hughes, G. |
|
1984 |
34 |
3-4 |
p. 365-369 5 p. |
artikel |
19 |
Optical film combinations for solar and thermal energy use
|
Howson, R.P. |
|
1984 |
34 |
3-4 |
p. 425-427 3 p. |
artikel |
20 |
Plasma diagnostics in ion-assisted physical vapour deposition systems
|
Hurley, R.E. |
|
1984 |
34 |
3-4 |
p. 351-355 5 p. |
artikel |
21 |
Plasma etching of silicon for semiconductor device fabrication
|
|
|
1984 |
34 |
3-4 |
p. 488- 1 p. |
artikel |
22 |
Plasma etching of titanium disilicide
|
Tomkins, G. |
|
1984 |
34 |
3-4 |
p. 451-454 4 p. |
artikel |
23 |
Reactive ion etching of quartz for device applications
|
|
|
1984 |
34 |
3-4 |
p. 488- 1 p. |
artikel |
24 |
Review: dry etching of silicon oxide
|
van Roosmalen, Alfred J. |
|
1984 |
34 |
3-4 |
p. 429-436 8 p. |
artikel |
25 |
Rutherford backscattering for thin film and surface analysis
|
|
|
1984 |
34 |
3-4 |
p. 489- 1 p. |
artikel |
26 |
Secondary ion mass spectrometry
|
Kenway-Jackson, C. |
|
1984 |
34 |
3-4 |
p. 479-480 2 p. |
artikel |
27 |
Spatially resolved optical spectroscopy of plasma etching systems
|
Field, D. |
|
1984 |
34 |
3-4 |
p. 347-349 3 p. |
artikel |
28 |
Sustaining mechanisms in rf plasmas
|
Gill, M.D. |
|
1984 |
34 |
3-4 |
p. 357-364 8 p. |
artikel |
29 |
The effect of ion species on bombardment induced topography during ion etching of silicon
|
Carter, G. |
|
1984 |
34 |
3-4 |
p. 445-450 6 p. |
artikel |
30 |
The plasma-enhanced deposition of hydrogenated amorphous silicon
|
Easton, B.C. |
|
1984 |
34 |
3-4 |
p. 371-376 6 p. |
artikel |
31 |
The properties and applications of low energy plasmas
|
Curran, J.E. |
|
1984 |
34 |
3-4 |
p. 343-345 3 p. |
artikel |
32 |
Use of thin films in optical waveguiding devices—a case study
|
Pitt, C.W. |
|
1984 |
34 |
3-4 |
p. 399-403 5 p. |
artikel |