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                             10 results found
no title author magazine year volume issue page(s) type
1 Adaptive simulation-based framework for error characterization of inexact circuits Bonnot, Justine
2019
96 C p. 60-70
article
2 Editorial Board 2019
96 C p. ii
article
3 Effect of pulse-reverse plating on copper: Thermal mechanical properties and microstructure relationship Huang, Bau-Chin
2019
96 C p. 71-77
article
4 Enhanced multiple-error resilient carry look-ahead adders through new customized fault-tolerant voters Valinataj, Mojtaba
2019
96 C p. 7-20
article
5 Improvement of the tolerated raw bit error rate in NAND flash-based SSDs with selective refresh Farjallah, Emna
2019
96 C p. 37-45
article
6 Investigation of the interfacial reactions between Sn-3.0 wt%Ag-0.5 wt%Cu solder and CuTi alloy (C1990HP) Yen, Yee-Wen
2019
96 C p. 29-36
article
7 Limitation of switching-self-clamping-mode “SSCM” in high voltage IGBTs Wang, Cailin
2019
96 C p. 1-6
article
8 Modeling simplification for thermal mechanical stress analysis of TSV interposer stack Xia, Kequan
2019
96 C p. 46-50
article
9 Performance reliability of ultra-thin Si-SiO2, Si-Al2O3, Si-ZrO2 and Si-HfO2 interface in rectangular steep retrograded nano-regimes devices Thakur, Rajiv Ranjan
2019
96 C p. 21-28
article
10 Transient-error correction system with real-time logic switching inspired from attractor-conversion characteristics of a cancer cell Yang, Isaak
2019
96 C p. 51-59
article
                             10 results found
 
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